Waferpedia

Tool family

Disco DAG 810

DiscoDicing & Grinding3 entries
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Models in this family

  1. DAG 810 Automatic

    The Disco DAG 810 is an automatic grinder for semiconductor wafer processing, offering a spindle rated at 4.2 kW, torque 5.9 N·m, and speed range 1,000 to 7,000 min⁻¹.

    Cited variants

    DesignationGenerationVintageChangesSource
    DAG 810 with Taiko Option——Includes Taiko process optionEquipment inventory listing[1]
  2. DAG 810 Back

    The Disco DAG 810 is a back grinder used for semiconductor wafer processing.

  3. DAG 810 Ring Removal

    The Disco DAG 810 is an automatic surface grinder for workpieces up to 8 inches, also sold as a ring removal tool for 6-inch wafers.

All entries

  1. DAG 810 AutomaticDisco

    The Disco DAG 810 is an automatic grinder for semiconductor wafer processing, offering a spindle rated at 4.2 kW, torque 5.9 N·m, and speed range 1,000 to 7,000 min⁻¹.

    CategoryDicing & Grinding
    28 specs
  2. DAG 810 BackDisco

    The Disco DAG 810 is a back grinder used for semiconductor wafer processing.

    CategoryDicing & Grinding
    14 specs
  3. DAG 810 Ring RemovalDisco

    The Disco DAG 810 is an automatic surface grinder for workpieces up to 8 inches, also sold as a ring removal tool for 6-inch wafers.

    10 specs

Sources

Sources (1)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing