Waferpedia

Disco

DAG 810 Automatic

Dicing & GrindingDisco DAG 810 family
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The Disco DAG 810 Automatic Grinder is a semiconductor wafer grinding tool for 8-inch wafers. The Disco DAG 810 offers a spindle rated at 4.2 kW with a torque of 5.9 N·m and a speed range of 1,000 to 7,000 min⁻¹. A Taiko option is available for the Disco DAG 810.[1]

DAG 810 Automatic — Inventory photo
Fig. 01DAG 810 AutomaticInventory photo[2]

What it is

The Disco DAG 810 Automatic is a semiconductor grinder.[2][3][1]

How it works

General reference — not yet source-verified

A grinder removes material from a wafer surface by controlled abrasive action to reduce thickness or prepare the wafer for later processing steps.

A dicing and grinding machine class typically combines backside grinding with wafer singulation-related handling so a wafer can be thinned and prepared for separation in a coordinated flow.

Where it fits in the process flow

General reference — not yet source-verified

The Disco DAG 810 Automatic fits in wafer thinning and preparation flow.

The Disco DAG 810 Automatic sits in a process sequence that commonly follows frontside fabrication and precedes downstream separation, packaging, or assembly steps.

Applications

The Disco DAG 810 Automatic is used for semiconductor wafer grinding applications.[2][3][1]

What do the numbers mean?

Power & electrical8

Voltage
100 V[3]
Accurate?
Phase
3 Phase[3]
Accurate?
50/60 Hz[3]
Accurate?
Voltage
200 Vac[1]
Accurate?
Spindle rated power
4.2 kW[1]
Accurate?
Voltage
100 V / 200 Vac[3]
Accurate?
Frequency
50/60 Hz[3]
Accurate?
Power supply
100 V, 3 phase, 50/60 Hz[3]
Accurate?

Wafer handling1

Wafer Sizes
8 inch[1]
Accurate?

Control & software5

Original control system and safety guard[1]
Accurate?
Touchscreen interface[1]
Accurate?
Control System
Original control system and safety guard, touchscreen interface[1]
Accurate?
Control system
Original control system[1]
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Interface
Touchscreen interface[1]
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Configuration & options14

Taiko Option[3]
Accurate?
Full Load Current
10 A[3]
Accurate?
Largest Load
3 A[3]
Accurate?
Interrupting Capacity
14 kA[3]
Accurate?
3 Wire + Ground[1]
Accurate?
Rated torque
5.9 N·m[1]
Accurate?
Speed range
1,000 to 7,000 min⁻¹[1]
Accurate?
Vintage
2016[1]
Accurate?
Wiring
3 Wire + Ground[1]
Accurate?
OEM
Disco[2]
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Model
DAG 810[2]
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Machine type
Automatic Grinder[2]
Accurate?
Taiko Option[3]
Accurate?
Safety guard
Original safety guard[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
DAG 810 with Taiko Option——Includes Taiko process optionEquipment inventory listing[3]
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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Voltage100 V[3]
  • Phase3 Phase[3]
  • Configuration50/60 Hz[3]
  • Voltage200 Vac[1]
  • Spindle rated power4.2 kW[1]
  • Voltage100 V / 200 Vac[3]
  • Frequency50/60 Hz[3]
  • Power supply100 V, 3 phase, 50/60 Hz[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the Disco DAG 810 Automatic?

The Disco DAG 810 Automatic is a semiconductor grinder.[2][3][1]

Not publicly documented

The following facts about the DAG 810 Automatic are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAG 810 Automatic are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the DAG 810 Automatic are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DAG 810 Automatic are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the DAG 810 Automatic is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the DAG 810 Automatic are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]Inventory photo
  4. [4]Inventory photo
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Last updated Oct 10, 2026.

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