Comparison ledger
Applied Materials 0010-03485 Magnet Assy, Disco DAG 810 Ring Removal, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03485 Magnet AssyApplied Materials | DAG 810 Ring RemovalDisco |
|---|---|---|
| OEM | Applied Materials | Disco |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-03485 Magnet Assy | Disco DAG 810 |
| Specifications | ||
| Configuration | WP AL 300mm PVD[1] | Convertible to 8"[5] |
| OEM | Applied Materials[1] | — |
| Model | 0010-03485[1] | — |
| Description | MAGNET ASSY, WP AL 300MM PVD[2] | — |
| Process | PVD[3] | — |
| Wafer size | 300mm[4] | — |
| Version | Spares[4] | — |
| Part Number | 0010-03485[1] | — |
| Manufacturer | Applied Materials[1] | — |
| Process Type | PVD (Physical Vapor Deposition)[1] | — |
| Application (Material) | Aluminum (AL)[1] | — |
| Wafer Diameter (associated) | 300 mm[1] | — |
| Supported workpiece size | — | Up to Φ8 inch (Φ4, 5, 6, 8 inch with universal chuck table)[6] |
| Grinding method | — | Anomalous in-feed grinding with wafer rotation[6] |
| Grinding wheel diameter | — | Φ200 mm[6] |
| Spindle rated output | — | 4.2 kW[6] |
| Spindle rated torque | — | 5.9 N·m[6] |
| Spindle rotation speed range | — | 1,000 – 7,000 min⁻¹[6] |
| Equipment dimensions (W × D × H) | — | 600 × 1,700 × 1,780 mm[6] |
| Equipment weight | — | Approx. 1,300 kg[6] |
| Wafer size (ring removal variant) | — | 6 inch (convertible to 8 inch)[5] |