Besi
2200 evo advanced
The Datacon 2200 evo advanced is a multi-module die bonder from Besi designed for mass production of multi-chip packages. The Datacon 2200 evo advanced achieves ±3 µm X/Y placement accuracy and supports die attach at up to 7,000 UPH per module. The Datacon 2200 evo advanced can handle flip chip and face-up die combinations, multiple epoxies in a single pass, and wafer sizes from 4" to 12".[1][2]
Power
400 VAC[3]
Vacuum
-0.08 MPa[3]
Performance
± 3 µm @ 3s[1]
Optics
up to 2,000 mW/cm2 (365 / 405 nm)[1]
How it works
The Datacon 2200 evo advanced uses an all-new gantry and controller system with a new vision and camera generation.[1][2]
The Datacon 2200 evo advanced offers ± 3 µm X/Y placement accuracy at 3 sigma and ± 0.07° theta placement accuracy at 3 sigma.[1][2][4]
The Datacon 2200 evo advanced supports programmable closed-loop bond force from 0.5 N to 25 N and bond rotation from 0° to 360°.[1][2]
The Datacon 2200 evo advanced can accommodate up to 14 different pick-up tools or nozzles and 5 eject tools, and can handle up to 3 different epoxies or adhesives in a single pass.[1][2]
The Datacon 2200 evo advanced includes dispensing options such as a high-end auger pump, time-pressure dispensing, piezo jetter valves, pin transfer, and auto epoxy volume control.[1][2]
The Datacon 2200 evo advanced offers an optional heated bond head up to 450 °C and optional UV curing with up to 2,000 mW/cm² at 365 nm or 405 nm.[1][2]
Where it fits in the process flow
The Datacon 2200 evo advanced can handle wafers from 4 inches to 12 inches (SEMI M1 standard) and accepts various frame sizes including FF070, FF105, FF108, and FF123 with automatic change.[1][2]
The Datacon 2200 evo advanced supports a substrate working range of 325 mm by 200 mm and can accommodate FR4, ceramic, BGA, flex, boat, lead frame, waffle pack, Gel-Pak, JEDEC tray, and odd-shape substrates.[1][2]
Applications
The Datacon 2200 evo advanced is used for die attach and flip chip applications, supporting multi-chip packages.[1]
The Datacon 2200 evo advanced can handle a die size range for die attach from 0.15 mm to 30 mm and for flip chip from 0.5 mm to 30 mm, with die thickness greater than 50 µm (thinner on request).[1][2]
The Datacon 2200 evo advanced supports any flip chip or face-up die combination and can apply up to three different epoxies or adhesives in a single pass.[1][2]
What do the numbers mean?
Power & electrical3
Vacuum & pumping1
Wafer handling2
Optics & imaging2
Performance2
Dimensions & facilities4
Configuration & options27
Observed configurations
How individual machines were equipped when they appeared on the secondary market — as listed, per unit. These describe one specific machine, not the model in general.
Unit as listed[3]
- Line voltage 400 VAC
- 3 Phase
- 50/60 Hz
- 2.3 kVA
- Max Current: 3.3 A
- Main Breaker: D16 A
- Vacuum: -0.08 MPa
- Compressed Air: 0.60 MPa
- Nitrogen: 0.10 MPa
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Datacon 2200 evo | — | — | The Datacon 2200 evo offers X/Y placement accuracy of ± 10 µm @ 3s and a bond force range of 0.5N to 75N, compared to the advanced model's ± 3 µm and 0.5N to 25N. | besi.com[5] |
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- ASM LinDA— Same function class: Packaging & Bonding, nullCompare in depthsource[6]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the X/Y placement accuracy of the Datacon 2200 evo advanced?
What is the maximum die attach throughput per module?
The maximum die attach throughput is up to 7,000 UPH per module.[1][2][4]
What die size range is supported for flip chip applications?
Flip chip die sizes from 0.5 mm to 30 mm are supported.[1][4]
What is the programmable bond force range?
The bond force range is 0.5N to 25N, programmable with closed-loop control.[1][2]
Not publicly documented
The following facts about the 2200 evo advanced are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2200 evo advanced are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 2200 evo advanced are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2200 evo advanced are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2200 evo advanced is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2200 evo advanced are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
- [2]Datacon 2200 evo advanced by BE Semiconductor Industries N.V. (Besi) | Albus — diagon.aidiagon.ai
- [3]Inventory photo
- [4]semiconductor.directory — semiconductor.directorysemiconductor.directory
- [5]besi.com — besi.combesi.com
- [6]waferpedia.comwaferpedia.com
Last updated Sep 24, 2026.
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