Besi 2200 evo advanced

Models in this family

1. 

   2200 evo advanced

   The Datacon 2200 evo advanced is a multi-chip die bonder offering ±3 µm placement accuracy and up to 7,000 UPH throughput for mass production applications.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Datacon 2200 evo	—	—	The Datacon 2200 evo offers X/Y placement accuracy of ± 10 µm @ 3s and a bond force range of 0.5N to 75N, compared to the advanced model's ± 3 µm and 0.5N to 25N.	besi.com[1]

Sources