Besi
2200 APM Die Attach Flip Chip
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
Where it fits in the process flow
General reference — not yet source-verifiedThe machine sits between upstream die preparation and downstream assembly steps that complete electrical and mechanical attachment to the package or substrate.
Applications
The Besi 2200 APM is used for die attach and flip chip packaging applications.[1][2][3]
The machine is used for multi-chip die bonding applications.[3]
What do the numbers mean?
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 2200 APM Die Attach Flip Chip are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2200 APM Die Attach Flip Chip are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2200 APM Die Attach Flip Chip are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2200 APM Die Attach Flip Chip are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2200 APM Die Attach Flip Chip are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2200 APM Die Attach Flip Chip is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]ibesmt.com — ibesmt.comibesmt.com
Last updated Oct 5, 2026.
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