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Axcelis

NV 8250 HT Ion

Ion ImplantationAxcelis NV 8250 family
Research Quality: 50% complete

The Axcelis NV 8250 HT is an ion implanter for 8-inch wafers. The NV 8250 HT operates on 208 VAC, 3-phase, 50/60 Hz power with a rating of 36 kVA.[1][2]

NV 8250 HT Ion — Inventory photo
Fig. 01NV 8250 HT IonInventory photo[1]

Power

208 VAC[2]

Vacuum

Cryopumps installed[1]

Gas delivery

Gas Box with SDS Bottles[1]

What it is

The Axcelis NV 8250 HT Ion is a semiconductor ion implantation tool manufactured by Axcelis. The NV 8250 HT Ion processes wafers with an eight-inch size. The NV 8250 HT Ion belongs to the Axcelis NV 8250 family. The electrical supply for the NV 8250 HT Ion is 208 VAC, three-phase, at 50/60 Hz. The power consumption of the NV 8250 HT Ion is 36 kVA. The input breaker of the NV 8250 HT Ion is rated at 100 A. The largest load of the NV 8250 HT Ion is 88 A. The maximum interrupt capacity of the NV 8250 HT Ion is 85 A.[1][2]

How it works

The NV 8250 HT Ion uses a Macobot robotic handler for in-air wafer handling. The gas box of the NV 8250 HT Ion is designed for SDS bottles. The vacuum system of the NV 8250 HT Ion includes cryopumps, eight Edwards turbo pumps, and rough pumps.[1]

Where it fits in the process flow

General reference — not yet source-verified

The NV 8250 HT Ion is used in the doping step of semiconductor device fabrication. The implant step follows patterning of the wafer with a resist mask and precedes an activation anneal. Ion implantation is applied to wafers in a cleanroom environment where particles and contamination are controlled.

Applications

General reference — not yet source-verified

Applications of ion implantation include the formation of source and drain regions in field-effect transistors. The technique is also used to form wells, to adjust threshold voltages, and to dope gate materials. Ion implantation supports fabrication of logic, memory, and power semiconductor devices.

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • Two parts on the lower lock are worn out, resulting in slight play while moving.
  • Possible vacuum and particle issue (internal, not external).
  • Pneumatic block in the terminal has a broken input line.
  • No CDA pressure to move valve.

What do the numbers mean?

Power & electrical4

Voltage
208 VAC[2]
Accurate?
Phase
3 Phase[2]
Accurate?
50/60 Hz[1]
Accurate?
Frequency
50/60 Hz[2]
Accurate?

Vacuum & pumping3

Cryopumps installed[1]
Accurate?
Turbo Pumps installed[1]
Accurate?
Rough pumps installed[1]
Accurate?

Wafer handling1

Wafer Size
8 inch[1]
Accurate?

Gas & chemistry1

Gas Box with SDS Bottles[1]
Accurate?

Configuration & options16

Power
36 kVA[1]
Accurate?
Input Breaker
100 A[2]
Accurate?
Largest Load
88 A[2]
Accurate?
Max. Interrupt Capacity
85 A[2]
Accurate?
Macobot for In-Air handling[1]
Accurate?
P3/P4/P5 On-Board 8 Edwards[1]
Accurate?
P1 STP 1003 C[1]
Accurate?
P2A STP 301C[1]
Accurate?
P2B STP 1003 C[1]
Accurate?
RP1 Edwards IGX 100 MTI[1]
Accurate?
RP2 Edwards QDP40[1]
Accurate?
RP3 Edwards iGX600M[1]
Accurate?
Issues:[1]
Accurate?
Category
Ion Implantation[2]
Accurate?
OEM
Axcelis[1]
Accurate?
Model
NV 8250 HT[1]
Accurate?
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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Voltage208 VAC[2]
  • Phase3 Phase[2]
  • Configuration50/60 Hz[1]
  • ConfigurationGas Box with SDS Bottles[1]
  • ConfigurationCryopumps installed[1]
  • ConfigurationTurbo Pumps installed[1]
  • ConfigurationRough pumps installed[1]
  • Frequency50/60 Hz[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

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Frequently asked questions

What are the typical energy ranges for ion implanters used in semiconductor manufacturing?General reference — not yet source-verified

Ion implanters are generally available in low-energy (for shallow implants), medium-energy, and high-energy (deep implants) variants. The specific energy range depends on the machine class and intended applications.

How does an ion implanter achieve uniform doping across a wafer?General reference — not yet source-verified

Uniformity is achieved by scanning the ion beam across the wafer surface using electrostatic or magnetic deflectors, often combined with wafer rotation or translation. Precise control of beam current, scan speed, and dwell time ensures consistent dopant distribution.

What maintenance is required for an ion implantation system?General reference — not yet source-verified

Regular maintenance includes replacing ion source components (filaments, electrodes), cleaning acceleration columns and vacuum chambers, monitoring beam optics, and calibrating dosimetry systems. Preventive maintenance intervals depend on usage and tool design.

What factors influence the throughput of an ion implantation system?General reference — not yet source-verified

Throughput is affected by beam current (higher current allows faster dosing), implantation energy (higher energy may reduce beam current), wafer size, required dose, and the number of implants per device. Tool design and automation also play significant roles.

Not publicly documented

The following facts about the NV 8250 HT Ion are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NV 8250 HT Ion are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the NV 8250 HT Ion are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the NV 8250 HT Ion are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the NV 8250 HT Ion is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the NV 8250 HT Ion are on record.

    Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
  3. [3]Inventory photo
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Last updated Oct 10, 2026.

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