Axcelis
GSD 200 E 2
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Axcelis GSD 200 E 2 is a high current ion implanter. The Axcelis GSD 200 E 2 operates at 180 KeV. The Axcelis GSD 200 E 2 processes 8-inch wafers.[1]
What it is
How it works
General reference — not yet source-verifiedAn ion implanter accelerates charged dopant ions and directs them into a wafer surface to alter electrical properties in selected regions.
A high current ion implanter emphasizes delivery of a large ion beam current for doping steps that need substantial implanted dose.
Where it fits in the process flow
General reference — not yet source-verifiedIon implantation is a front-end wafer doping step in semiconductor manufacturing.
Ion implantation typically follows pattern definition and resist or mask preparation and precedes thermal steps that activate or repair the implanted region.
Applications
General reference — not yet source-verifiedIon implanters are used to form doped regions in silicon and other semiconductor substrates.
High current implantation is used for semiconductor doping steps that require substantial implanted dose.
What do the numbers mean?
Power & electrical5
Wafer handling2
Configuration & options7
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the GSD 200 E 2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the GSD 200 E 2 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the GSD 200 E 2 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the GSD 200 E 2 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the GSD 200 E 2 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the GSD 200 E 2 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]asseta.com — asseta.comasseta.com
- [2]Inventory photo
- [3]Inventory photo
- [4]Equipment inventory listing
Last updated Oct 7, 2026.
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