EV Group 850

Models in this family

1. 850

   The EVG 850 is a wafer bonding system from EV Group supporting wafer sizes from 2 to 12 inches.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   EVG 850 LT	—	—	Automated production bonding system for SOI and direct wafer bonding with LowTemp plasma activation	evgroup.com[1]
   EVG 850 TB	—	—	Fully automated temporary bonding system for temporary adhesive application, baking, alignment and bonding of device wafer to carrier wafer	evgroup.com[2]

2. 

   850 Debonder

   The EV Group 850 Debonder is a packaging and bonding tool for debonding temporary-bonded wafer stacks and cleaning separated wafers.

3. 

   850 LT

   The EVG 850 LT is an 8-inch bonder with wafer ID reader, prebond, IR inspection, plasma activation, and automated handling features.

4. 850 LT SOI Fusion Wafer

   The EV Group 850 LT SOI Fusion Wafer Bonder is a fully automatic wafer bonder configured for 8-inch/200mm wafers.

5. 

   850 SOI Wafer

   The EVG 850 SOI Wafer Bonder is a fully automatic wafer bonder suitable for wafer sizes up to 6 inch/150mm and currently configured for 6 inch/150mm wafers.

6. 850 TBL

   The EV Group 850 TBL is an automated bonding system with Laminator.

7. 

   850 Wafer

Sources