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CV108

Single-wafer downstream plasma stripper/descummer200mmYES CV108 family
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The CV108 is a single-wafer, downstream plasma stripper/descummer. The CV108 removes photoresist or polyimide coatings from 150 or 200mm wafers. The CV108 uses microwave energy to ionize oxygen gas.[1][2]

CV108 — web.archive.org
Fig. 01CV108web.archive.org[1]

Wafer size

200mm

Power

up to 2 kW per process chamber[1]

Vacuum

four-inch OD house exhaust[1]

Gas delivery

photoresist, polyimide and B.C.B. removal[1]

What it is

The YES CV108 is a single-wafer downstream plasma stripper and descummer.[1][2]

How it works

A downstream plasma stripper uses microwave energy to ionize oxygen gas and create an oxygen plasma.[1][2]

The oxygen plasma reacts with organic coatings and converts them to carbon dioxide and water vapor that are removed by vacuum exhaust.[1][2]

The downstream chamber design is intended to prevent ion acceleration and electron damage at the wafer surface.[1][2]

The CV108 uses two mass flow controllers, automated microwave tuning, variable microwave power, variable process pressure, and wafer-contact temperature control by thermocouple.[1][2]

Where it fits in the process flow

The CV108 is used for photoresist, polyimide, and B.C.B. removal.[1][2][3]

Applications

The CV108 is used for removing photoresist coatings from wafers.[1][2]

The CV108 is used for removing polyimide coatings from wafers.[1][2]

The CV108 is used for removing B.C.B. coatings from wafers.[1][2][3]

  • Removal of photoresist
  • Removal of polyimide coatings
  • Removal of B.C.B. coatings

What do the numbers mean?

Power & electrical3

Microwave power
up to 2 kW per process chamber[1]
Accurate?
Main power
30 amps at 125V[1]
Accurate?
Microwave power
30 amps at 208V[1]
Accurate?

Vacuum & pumping2

Process pressure
variable; high pressure for fast etch-rate or low pressure for enhanced uniformity[1]
Accurate?
House exhaust
four-inch OD house exhaust[1]
Accurate?

Wafer handling5

Wafer size
4-8 in.[1]
Accurate?
Wafer size
150 or 200mm wafers[1]
Accurate?
Wafer size
6-8 in. (Auto Detect)[3]
Accurate?
Process
single-wafer, downstream plasma stripper/descummer[2]
Accurate?
Process temperature control
thermocouple in contact with the wafer[1]
Accurate?

Gas & chemistry8

Process materials removed
photoresist, polyimide and B.C.B. removal[1]
Accurate?
Endpoint detection
patented gas swirl end point detection / new patent-pending method[1]
Accurate?
Mass flow controllers
two mass flow controllers[1]
Accurate?
Process
Photoresist, polyimide and B.C.B removal[1]
Accurate?
Process gas
Oxygen (O2) electronic grade[1]
Accurate?
Process gas
Customer specified[1]
Accurate?
Endpoint detection
New patent-pending method; patented gas swirl endpoint detection of resist and polyimide removal[1]
Accurate?
Mass flow controllers
Two[1]
Accurate?

Control & software3

Software
five permanent process recipes plus a user-defined sixth recipe[1]
Accurate?
Software
PLC control / touchscreen interface[3]
Accurate?
Control interface
PLC control / touchscreen interface[3]
Accurate?

Dimensions & facilities1

Dimensions
66 in H x 55 in W x 58 in D[1]
Accurate?

Configuration & options3

Strip rate
up to 20,000 Å/min[1]
Accurate?
System cooling
chilled water, 3.5 gallons per minute at 15-20°C[1]
Accurate?
Power
Up to 2kW of energy, per process chamber[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Process materials removedphotoresist, polyimide and B.C.B. removal[1]
  • Endpoint detectionpatented gas swirl end point detection / new patent-pending method[1]
  • Mass flow controllerstwo mass flow controllers[1]
  • Microwave powerup to 2 kW per process chamber[1]
  • Process pressurevariable; high pressure for fast etch-rate or low pressure for enhanced uniformity[1]
  • Main power30 amps at 125V[1]
  • Microwave power30 amps at 208V[1]
  • House exhaustfour-inch OD house exhaust[1]
  • ProcessPhotoresist, polyimide and B.C.B removal[1]
  • Process gasOxygen (O2) electronic grade[1]
  • Process gasCustomer specified[1]
  • Endpoint detectionNew patent-pending method; patented gas swirl endpoint detection of resist and polyimide removal[1]
  • Mass flow controllersTwo[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What materials does the CV108 remove?

The CV108 removes photoresist, polyimide, and B.C.B. coatings.[1][2][3]

Not publicly documented

The following facts about the CV108 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CV108 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the CV108 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the CV108 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the CV108 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the CV108 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]web.archive.org — web.archive.orgweb.archive.org
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Last updated Oct 5, 2026.