Ulvac
NE-550
The Ulvac NE-550 is a multi-purpose high-density, low-pressure plasma etching system. The NE-550 is capable of etching many materials including III-V, metals, ceramics, and optical materials. The NE-550 uses an ISM (Inductively Super Magnetron) plasma source.[1][2]
Plate 01Model：NE-550 高密度プラズマエッチング装置 - 研究開発向けの最適なソリューション
アルバックテクノ株式会社Watch on YouTube
What it is
The Ulvac NE-550 is a high-density plasma etching system, specifically designed for research-and-development test facilities such as universities and government agencies.[2][4]
The NE-550 is a chlorine etcher, capable of etching a wide range of materials including III-V semiconductors, metals, ceramics, and optical materials.[1]
How it works
The NE-550 generates a high-density, low-pressure plasma using an ISM (Inductively Super Magnetron) plasma source, a ULVAC-patented design that enables control of plasma density and uniformity by optimizing the magnetic field.[2]
The etching chamber incorporates a STAR electrode, another ULVAC patent, which contributes to good repeatability and process stability.[2]
The system supports a wide range of process control from ion etching to radical etching, and wafer temperature is regulated through an electrostatic chuck (ESC) with helium backside cooling or a mechanical chuck.[2]
End-point detection is provided via an optical spectrometer as standard, with optional optical emission end-point detection and laser interference end-point detection available.[2][4]
Where it fits in the process flow
The system processes single wafers, accepting diameters of 100 mm, 150 mm, and 200 mm, and wafer types including silicon, quartz, Pyrex, and silicon on insulator.[4]
Applications
Additional applications include etching of silicon and silicon carbide, machining of optical materials (sapphire, glass, quartz), and processing of organic materials like polyimide and BCB.[2]
- Chlorine etching
- Etching III-V materials
- Etching metals
- Etching ceramics
- Etching optical materials
What do the numbers mean?
Vacuum & pumping1
Wafer handling9
- Wafer materials
- Pyrex (Corning 7740), quartz (fused silica), silicon on insulator, quartz (single crystal), silicon carbide, fused silica, silicon germanium, silicon[4]
Optics & imaging2
Performance1
Dimensions & facilities1
Configuration & options10
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| NE-550H | — | — | NE-550H is a multipurpose high-density plasma etching system, specifically for R&D test facilities such as universities and government agencies. | ulvac.eu[2] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- System typeMultipurpose high-density, low-pressure plasma etching system[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the Ulvac NE-550 support?
The NE-550 accepts wafer diameters of 100 mm, 150 mm, and 200 mm, and processes a single wafer per run.[4]
What wafer materials can the NE-550 handle?
The system can process wafers made of silicon, silicon on insulator, silicon carbide, silicon germanium, Pyrex, fused silica, and quartz.[4]
Does the NE-550 have end-point detection?
The system includes an optical spectrometer for end-point control, with optional optical emission end-point detection and laser interference end-point detection.[2][4]
What is the plasma source used in the NE-550?
The NE-550 uses an ISM (Inductively Super Magnetron) plasma source, which is a ULVAC-patented design providing low-pressure, high-density plasma with controlled uniformity.[2]
Not publicly documented
The following facts about the NE-550 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NE-550 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the NE-550 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the NE-550 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the NE-550 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the NE-550 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]nanolab.ucla.edu — nanolab.ucla.edunanolab.ucla.edu
- [2]ulvac.eu — ulvac.euulvac.eu
- [3]nanolab.ucla.edu — nanolab.ucla.edunanolab.ucla.edu
- [4]microsystems.org — microsystems.orgmicrosystems.org
- [5]Equipment | UCLA Nanolab — nanolab.ucla.edunanolab.ucla.edu
Last updated Sep 30, 2026.
Compare with similar tools
View all →The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.
