Tokyo Electron

Expedius

Wet Processing / Clean Tokyo Electron Expedius family

Research Quality: 40% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

Expedius — Inventory photo — Fig. 01ExpediusInventory photo^[1]

How it works

The Expedius is based on the CLEAN TRACK MARK 7 platform, which provides a non-vacuum wafer transfer capability.^[2]

The machine uses unique brushes and mechanical chuck to clean both sides of the wafer on a carrier-to-carrier basis.^[2]

Applications

The brush cleaning capability can be expanded with high-pressure jet spray or megasonic cleaning options.^[2]

What do the numbers mean?

Vacuum & pumping5

Transfer system: Vacuumless robotic transport^[2]
Chuck type: Mechanical and vacuum chucks^[2]
Brush pressure control: Automatic brush pressure controller^[2]
Optional cleaning modules: High-pressure jet spray or megasonic clean^[2]
Wafer transfer: non-vacuum wafer transfer capability^[2]

Wafer handling4

Wafer size capability: 5 to 8 inches^[2]
Cleaning capability: Both sides of wafer^[2]
Wafer capability: 5 inch to 8 inch^[2]
Cleaning capability: cleaning both sides of the wafer^[2]

Control & software1

Interface: SMIF interface^[2]

Configuration & options7

single block^[1]
Platform: CLEAN TRACK MARK 7^[2]
Host communication: GEM host communication^[2]
Compliance: S2-93 and CE mark^[2]
OEM: Tokyo Electron^[1]
Model: Expedius^[1]
Equipment type: Wet Bench^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Transfer systemVacuumless robotic transport^[2]
Chuck typeMechanical and vacuum chucks^[2]
Brush pressure controlAutomatic brush pressure controller^[2]
Optional cleaning modulesHigh-pressure jet spray or megasonic clean^[2]
Wafer transfernon-vacuum wafer transfer capability^[2]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What are the typical throughput and footprint considerations for such systems?General reference — not yet source-verified

Throughput depends on the number of process chambers and the recipe time per wafer. Single-wafer tools generally have lower throughput than batch tools but offer better process control. Footprint is moderate; systems are often arranged in a cluster configuration with multiple chambers sharing a central wafer handler. Space for chemical cabinets and plumbing must also be included in the fab layout.

How do these systems handle chemical waste and environmental safety?General reference — not yet source-verified

Wet processing systems are designed with integrated drain systems to collect spent chemicals and rinse water. Many incorporate point‑of‑use filtration and on‑line chemical blending to reduce waste. Exhaust systems remove volatile vapors. Safety features include chemical sensors, leak detection, interlock doors, and emergency shutdown. The tool itself must be placed in a corrosive‑resistant environment with appropriate ventilation.

What maintenance and consumables are required for reliable operation?General reference — not yet source-verified

Regular maintenance includes replacement of chemical filters, o‑rings, seals, and cleaning of nozzles and drain lines. Consumables include chemical containers (drums or bottles), deionized water, and drying gases such as nitrogen. The spin chuck and associated robotics may require periodic calibration and cleaning. Preventive maintenance schedules are critical to avoid particle generation and chemical cross‑contamination.

Not publicly documented

The following facts about the Expedius are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Expedius are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Expedius are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Expedius are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Expedius are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Expedius is not on record.
Answerable by: an OEM datasheet or a fab qualification report