Waferpedia

Teradyne

ETS 200 T

Test & ProbeTeradyne ETS 200 family
Research Quality: 40% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Teradyne / Eagle ETS 200 T is a tester. The Teradyne / Eagle ETS 200 T is used with an Electroglas EG 4090 prober for 8-inch wafers.[1]

ETS 200 T — Inventory photo
Fig. 01ETS 200 TInventory photo[1]

What it is

The Teradyne ETS 200 T is a test system manufactured by Teradyne and Eagle.[1]

How it works

General reference — not yet source-verified

Mixed-signal testers like the ETS series provide stimulus and measurement for both analog and digital signals. The system uses a modular architecture with plug-in instrument cards that generate waveforms, apply voltages or currents, and capture responses. The test head interfaces directly with the prober or handler, routing signals to the device under test through a probe card or contactor.

Where it fits in the process flow

General reference — not yet source-verified

In semiconductor manufacturing, mixed-signal testers are used for wafer sort (also called probe test) and final package test. Wafer sort occurs after all fabrication steps are complete, before dicing and packaging. The probed wafer is then singulated, and good die are assembled into packages. Final test on packaged devices may use a separate handler-based test system.

Applications

General reference — not yet source-verified

Mixed-signal testers are applied to devices that combine analog and digital circuitry, such as power management ICs, audio amplifiers, data converters, sensor interfaces, and RF transceivers. The ETS platform is suited for production testing of medium- to high-volume mixed-signal devices requiring parametric accuracy and repeatability.

What do the numbers mean?

Configuration & options2

With Electroglas EG 4090 & 4090 u+ Prober (8")[1]
Accurate?
Boards Removed[1]
Accurate?
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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the ETS 200 T are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • Fewer than 3 independently cited specifications for the ETS 200 T are on record; the remainder await public documentation.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ETS 200 T are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the ETS 200 T are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the ETS 200 T are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the ETS 200 T are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]Inventory photo
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Last updated Sep 24, 2026.

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