Waferpedia

Tegal

901

EtchTegal 901 family
Research Quality: 50% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

901 — Inventory photo
Fig. 01901Inventory photo[1]

What it is

The Tegal 901 ACS is a plasma etch reactor designed for non-critical silicon nitride and photoresist trim processing. The reactor accepts wafers of 3 inch, 100 millimeter, and 150 millimeter diameter. The wide-gap RF diode configuration supports low-temperature plasma etch without wafer clamps or electrostatic chucks.[4]

How it works

The Tegal 901 uses a wide-gap RF diode reactor for plasma generation. The wide-gap design allows processing of delicate organic materials at low temperature. The reactor does not require wafer clamps or electrostatic chucks to hold the wafer.[4]

Where it fits in the process flow

The Tegal 901 ACS is designed for non-critical silicon nitride and photoresist trim processing. The system serves the traditional CMOS and Bipolar silicon semiconductor industry, as well as GaAs, InP, and SiGe compound semiconductors. The same platform also applies to MEMS, advanced packaging, thin film head, and bio-chip nanotechnology processes.[4]

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • Incomplete unit

What do the numbers mean?

Power & electrical1

Reactor type
wide gap RF diode reactor[4]
Accurate?

Wafer handling2

Wafer size
3 inch, 100 mm to 150 mm[4]
Accurate?
Wafer handling
no wafer clamps or electrostatic chucks[4]
Accurate?

Gas & chemistry1

Primary process
non-critical silicon nitride and photoresist trim[4]
Accurate?

Configuration & options4

Poly[2]
Accurate?
incomplete unit[3]
Accurate?
Temperature regime
low temperature plasma etch[4]
Accurate?
Additional process
poly etching[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Primary processnon-critical silicon nitride and photoresist trim[4]
  • Reactor typewide gap RF diode reactor[4]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the Tegal 901?

The Tegal 901 is an etcher.[2][3][5][1]

Not publicly documented

The following facts about the 901 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 901 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 901 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 901 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the 901 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 901 are on record.

    Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]web.archive.org — tegal.com (Jan 8, 2011)web.archive.org
  5. [5]Equipment inventory listing
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Last updated Sep 23, 2026.

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