Tegal
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The Tegal 901 ACS is a plasma etch reactor designed for non-critical silicon nitride and photoresist trim processing. The reactor accepts wafers of 3 inch, 100 millimeter, and 150 millimeter diameter. The wide-gap RF diode configuration supports low-temperature plasma etch without wafer clamps or electrostatic chucks.[4]
The Tegal 901 uses a wide-gap RF diode reactor for plasma generation. The wide-gap design allows processing of delicate organic materials at low temperature. The reactor does not require wafer clamps or electrostatic chucks to hold the wafer.[4]
The Tegal 901 ACS is designed for non-critical silicon nitride and photoresist trim processing. The system serves the traditional CMOS and Bipolar silicon semiconductor industry, as well as GaAs, InP, and SiGe compound semiconductors. The same platform also applies to MEMS, advanced packaging, thin film head, and bio-chip nanotechnology processes.[4]
Documented failure modes, common issues, and field considerations.
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The following facts about the 901 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 901 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 901 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 901 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 901 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 901 are on record.
Answerable by: an OEM parts catalog or a service engineer
Last updated Sep 23, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.