Waferpedia

Comparison ledger

0041-39086 ESC Partversus901

Applied Materials 0041-39086 ESC Part, Tegal 901, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0041-39086 ESC PartApplied Materials
901Tegal
OEMApplied MaterialsTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Tegal 901
Specifications
Configuration—Poly[1]
Wafer size—3 inch, 100 mm to 150 mm[3]
Primary process—non-critical silicon nitride and photoresist trim[3]
Reactor type—wide gap RF diode reactor[3]
Temperature regime—low temperature plasma etch[3]
Wafer handling—no wafer clamps or electrostatic chucks[3]
Additional process—poly etching[1]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]web.archive.orgweb.archive.org