SUSS MicroTec
Delta 80 T 2 Spin
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The SUSS Delta 80 T 2 Spin is a spin coater and bake unit. The SUSS Delta 80 T 2 Spin handles 8-inch wafers. The SUSS Delta 80 T 2 Spin belongs to the thermal/diffusion category.[1][2]
What it is
How it works
General reference — not yet source-verifiedSpin coaters apply a liquid photoresist or other coating to a wafer by spinning the wafer at high speed, using centrifugal force to spread the material into a uniform thin layer. The bake component of the system then heats the coated wafer to drive off solvents and stabilize the film before subsequent processing steps.
Where it fits in the process flow
General reference — not yet source-verifiedIn a semiconductor fabrication line, spin coaters and bake units are placed early in the photolithography process sequence. The spin coater applies photoresist after wafer cleaning and dehydration bake, and the subsequent soft bake step precedes the exposure of the resist through a mask or reticle. After development and hard bake, the wafer moves to etching or ion implantation.
Applications
General reference — not yet source-verifiedThe Delta 80 T 2 Spin is used for applying photoresist in photolithography for integrated circuit and micro-electromechanical systems (MEMS) manufacturing. The bake function supports both soft bake of resist coatings and other thermal processing steps such as dehydration baking and hard baking after development.
What do the numbers mean?
Wafer handling1
Configuration & options1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Delta 80 T 2 Spin are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the Delta 80 T 2 Spin are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Delta 80 T 2 Spin are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Delta 80 T 2 Spin are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Delta 80 T 2 Spin are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Delta 80 T 2 Spin are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 7, 2026.
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