SUSS MicroTec
260 MS 022 Lithography Exposure
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedMask aligners operate by aligning a photomask with a wafer and then exposing the wafer to ultraviolet light through the mask. The light passes through transparent regions of the mask and exposes a photosensitive photoresist layer on the wafer.
Following exposure, the photoresist is chemically developed to create a patterned etch mask for subsequent fabrication steps.
Where it fits in the process flow
General reference — not yet source-verifiedUpstream processes include wafer cleaning and priming, spin-coating of photoresist, and a soft bake. Downstream steps include developing, hard baking, and pattern transfer via etching or ion implantation.
What do the numbers mean?
Wafer handling1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the 260 MS 022 Lithography Exposure are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the 260 MS 022 Lithography Exposure are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 260 MS 022 Lithography Exposure are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 260 MS 022 Lithography Exposure are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 260 MS 022 Lithography Exposure are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 260 MS 022 Lithography Exposure are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]260 MS 022 Lithography Exposure — SUSS MicroTec | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 4, 2026.
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