Shinkawa

UTC 1000

Packaging & Bonding Shinkawa UTC family

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UTC 1000 — Inventory photo — Fig. 01UTC 1000Inventory photo^[1]

Plate 01SHINKAWA UTC 1000 SUPER WIRE BONDER
ASE SEMICONDUCTORWatch on YouTube
Plate 02USED BCP-05B board for shinkawa UTC-1000
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Plate 03USED BCP-05C board for shinkawa UTC-1000
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Plate 04USED ZUP-02D board for shinkawa UTC-1000
SDL Industrial ClubWatch on YouTube
Plate 05USED FRP-341E board for shinkawa UTC-1000
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Plate 06A048602-2, UTC-1000 Bond Head
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Power

AC 100 V +/- 5 % 50/60 Hz^[1]

Performance

±2.5 µm^[1]

How it works

The UTC 1000 uses a gray-scale correlation method for pattern recognition, with a detection speed of 0.11 s maximum for two-point alignment including move time. The detection area for the lead side is ±1.26 mm in X and ±0.86 mm in Y, while the die side is ±0.31 mm in X and ±0.21 mm in Y. The bonding area spans ±28 mm in X and ±33 mm in Y.^[1]

What do the numbers mean?

Power & electrical1

Power Supply: AC 100 V +/- 5 % 50/60 Hz^[1]

Vacuum & pumping1

Vacuum pressure: -74 kPa (-550 mmHg) or less (Gauge Pressure)^[1]

Wafer handling4

Loader / Unloader: Magazine Stacker Type^[1]
Indexer: Center-Parting Type Universal Indexer^[1]
Loader/Unloader Type: Magazine Stacker Type^[1]
Indexer Type: Center-Parting Type Universal Indexer^[1]

Performance5

Machine Accuracy: +/- 2.5 µm (+/- 3.3 µm for multi-bonding setting)^[1]
Detection Speed: 0.11 s Max,. / 2 Point Alignment (including move time)^[1]
Machine Accuracy (single bond): ±2.5 µm^[1]
Machine Accuracy (multi-bonding): ±3.3 µm^[1]
Pattern Recognition Detection Speed: 0.11 s max for 2-point alignment (including move time)^[1]

Control & software1

Bonding Speed: 67 ms / 2 mm Wire (With Loop Control)^[1]

Dimensions & facilities5

Dimensions & Mass: 1080 W x 950 D x 1940 H mm , Approx. 590 kg^[1]
Dimensions (W x D x H): 1080 x 950 x 1940 mm^[1]
Mass: Approx. 590 kg^[1]
Applicable Lead Frame Width: 20–80 mm^[1]
Width: 20 ~ 80 mm^[1]

Configuration & options23

Bonding Method: Ultrasonic Thermo Compression^[1]
Bonding Wire Length: Max. 8 mm^[1]
Number of Bonding Wires: 8000 Wires^[1]
Power Consumption: Approx. 1000 W^[1]
Compressed Air: 500 kPa {5 kgf / cm²} 60 I / min^[1]; Pattern Recognition Unit:^[1]
Detection Method: Gray Scale Correlation^[1]; Detection Area:^[1]
Lead Side: MAx. X: +/- 1.26 mm, Y: +/- 0.86 mm^[1]
Die Side: Max. X: +/- 0.31 mm, Y: +/- 0.21 mm^[1]
Bonding Area: X: +/- 28 mm, Y: +/- 33 mm^[1]; Wire Diameter:^[1]
Max Bonding Wire Length: 8 mm^[1]
Pattern Recognition Detection Method: Gray Scale Correlation^[1]
Detection Area (Lead Side): Max X: ±1.26 mm, Y: ±0.86 mm^[1]
Detection Area (Die Side): Max X: ±0.31 mm, Y: ±0.21 mm^[1]
Wire Diameter (Gold Wire): Ø15–38 µm, 2-inch double flange spool^[1]
Applicable Lead Frame Length: 95–262 mm^[1]
Applicable Lead Frame Thickness: 0.07–0.3 mm^[1]
Gold Wire: Ø 15 ~ 38 µm^[1]
Length: 95 ~ 262 mm^[1]
Bonding Wire Length: Max 8 mm (depending on device conditions)^[2]
Number of Bonding Wires: Max. 8000 wires^[2]

Vintage & configurations

2005Vintage^[1]
The source lists vintage years 2005 (21), 2006 (7), and 2007 (4).

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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

Kulicke & Soffa Rapid Plus— Same function class: Packaging & Bonding, UnknownCompare in depthsource^[3]
Besi DS 9000 E— Same function class: Packaging & Bonding, nullCompare in depthsource^[4]

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Power SupplyAC 100 V +/- 5 % 50/60 Hz^[1]
Vacuum pressure-74 kPa (-550 mmHg) or less (Gauge Pressure)^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What types of materials can be bonded with this class of machine?General reference — not yet source-verified

Packaging and bonding machines typically work with metal contacts, semiconductor dies, optical crystals, glass, and polymer packages. The specific material combination depends on the bond type—metallurgical bonds for conductive connections or adhesive bonds for sealing.

How is bond quality verified?General reference — not yet source-verified

Bond quality is commonly assessed through pull or shear testing to measure mechanical strength, electrical resistance measurement for conductive bonds, and visual inspection with high-magnification cameras to check for alignment and bond formation consistency.

What are the typical consumables required?General reference — not yet source-verified

Common consumables include bonding wire (e.g., gold, aluminum), solder preforms, adhesive films or pastes, and shielding gases that protect the bond area from oxidation during thermal processes.

Is the bonding process automated?General reference — not yet source-verified

Yes, modern machines in this class are largely automated, featuring computer-controlled positioning, programmable bond parameters, and vision-guided alignment systems to achieve high throughput and repeatability.

What are the main challenges when using packaging and bonding machines?General reference — not yet source-verified

Key challenges include achieving consistent bond strength across varying material properties, compensating for thermal expansion mismatches, and maintaining clean bond interfaces free of contaminants that could compromise electrical or optical performance.

Not publicly documented

The following facts about the UTC 1000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented variants, configuration options, or revision breakpoints of the UTC 1000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UTC 1000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UTC 1000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UTC 1000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the UTC 1000 are on record.
Answerable by: an OEM parts catalog or a service engineer