Lam Research
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The LAM 2300 Versys Kiyo 45 is a high-density plasma etch system designed for advanced patterning applications. The LAM 2300 Versys Kiyo 45 supports 300mm wafers and is used for conductor and silicon etch processes. The LAM 2300 Versys Kiyo 45 offers precise anisotropic etching, excellent critical dimension control, and high aspect ratio capability.[1]
An etch system uses a plasma or reactive gas environment to remove exposed material while a patterned mask protects other areas of the wafer.
The Lam Research 2300 Versys Kiyo 45 is used for critical etch steps in semiconductor pattern transfer.[1]
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The following facts about the 2300 Versys Kiyo 45 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2300 Versys Kiyo 45 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2300 Versys Kiyo 45 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2300 Versys Kiyo 45 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2300 Versys Kiyo 45 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2300 Versys Kiyo 45 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 7, 2026.
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