Waferpedia

GCA

200

The GCA 200 is an i-line (365 nm) wafer stepper. The GCA 200 is a step-and-repeat exposure tool for lithography. The GCA 200 supports wafers up to 6 inches in diameter.[1]

200 — wiki.nanotech.ucsb.edu
Fig. 01200wiki.nanotech.ucsb.edu[1]

Wafer size

up to 6-inch diameter wafers; substrate size approximately 10 x 10 mm up to 100 mm, with 150 mm possible

Node / era

i-line

Optics

i-line (365 nm)[1]

What it is

The GCA 200 is an i-line wafer stepper used for lithography.[1]

How it works

The GCA 200 exposes a mask image through reduction optics and repeats that image across the substrate in discrete fields.[1]

The GCA 200 uses an Olympus 2145 lens with numerical aperture 0.45 and 5x mask image reduction.[1]

Applications

The GCA 200 is used for lithography that requires high resolution and critical alignment.[1]

The GCA 200 supports manual wafer loading, piece parts smaller than ten millimeters by ten millimeters, and substrates up to six-inch diameter wafers.[1]

The GCA 200 is used for i-line exposure at 365 nanometers.[1]

  • Lithography requiring high resolution
  • Lithography requiring critical alignment

What do the numbers mean?

Wafer handling4

Description
GCA 200 I-Line Wafer Stepper[1]
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Wafer loading
Manual wafer loading[1]
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Supported wafer diameter
Up to 6 inches[1]
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I-line intensity
About 420 mW/cm² at the wafer with a 1000 W Hg arc lamp[1]
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Optics & imaging7

Exposure wavelength
i-line (365 nm)[1]
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Exposure mode
Step and repeat[1]
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Lens
Olympus 2145[1]
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Numerical aperture
0.45[1]
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Mask reduction
5x[1]
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Ultimate resolution
Better than 0.5 um in the center of the lens field[1]
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Resolution across field
0.7 um isolated lines across the entire field[1]
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Performance1

Alignment tolerance
Better than 0.25 um global alignment; better than 0.15 um local alignment[1]
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Control & software1

Control
Computer controlled; recipes can be programmed and saved on hard disk[1]
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Configuration & options4

Manufacturer
GCA[1]
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Tool type
Lithography[1]
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Supported piece parts
Down to smaller than 10 mm x 10 mm[1]
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Maximum square die size
14.8 mm x 14.8 mm[1]
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What kinds of substrates can the GCA 200 handle?

The GCA 200 supports piece parts smaller than ten millimeters by ten millimeters and wafers up to six-inch diameter.[1]

What lens does the GCA 200 use?

The GCA 200 uses an Olympus 2145 lens with numerical aperture 0.45.[1]

What reduction ratio does the GCA 200 apply to the mask image?

The GCA 200 reduces the mask image by 5x.[1]

Not publicly documented

The following facts about the 200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 200 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 200 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 200 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 200 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • No publicly documented compatible parts, consumables, or accessories for the 200 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]wiki.nanotech.ucsb.edu — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
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Last updated Oct 9, 2026.

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