Esec
Datacon 8800 CHAMEO advanced
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Datacon 8800 CHAMEO advanced is a flip chip bonder. The Datacon 8800 CHAMEO advanced supports face-down and face-up package designs. The Datacon 8800 CHAMEO advanced is specified for 8" to 12" wafer sizes on 8" or 12" wafer frames.[1][2]
Wafer size
4"
Performance
± 3 µm at 3 sigma[1]
What it is
The Datacon 8800 CHAMEO advanced is an automatic wafer die attach and flip chip bonding machine for semiconductor assembly and packaging.[4][1]
The Datacon 8800 CHAMEO advanced is a Besi packaging platform for chip attach in wafer-level fan-out packaging and related advanced packaging processes.[1][2]
How it works
The Datacon 8800 CHAMEO advanced places dies with a bond head, machine vision, and controlled bond force.[4][1]
The Datacon 8800 CHAMEO advanced supports face-down and face-up package designs, and it can run both flip mode and non flip mode process flows.[1][2]
The Datacon 8800 CHAMEO advanced supports local reflow, fluxer use, and multi chip operation.[1]
Where it fits in the process flow
Applications
What do the numbers mean?
Wafer handling7
- Vision system
- 6 x 6 mm FoV for substrate and upwards camera; 12 x 12 mm FoV for wafer camera[1]
Performance5
Dimensions & facilities2
Configuration & options16
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What packaging flow is the Datacon 8800 CHAMEO advanced aimed at?
The Datacon 8800 CHAMEO advanced is aimed at wafer-level fan-out packaging, chip attach, advanced chip-to-wafer assembly, and through-silicon-via applications.[1][2]
Which package orientations does the Datacon 8800 CHAMEO advanced support?
The Datacon 8800 CHAMEO advanced supports face-down flip mode and face-up non-flip mode package designs.[1][2]
What die and wafer sizes are specified for the Datacon 8800 CHAMEO advanced?
The Datacon 8800 CHAMEO advanced is specified for die sizes from 0.3 mm to 30 mm, face-up die sizes from 2.5 mm to 25 mm, die thickness from 50 µm to 3 mm, and wafer sizes from 8 inches to 12 inches on 8-inch or 12-inch wafer frames.[1]
Does the Datacon 8800 CHAMEO advanced support multi-chip work?
The Datacon 8800 CHAMEO advanced includes multi-chip capability.[1]
Not publicly documented
The following facts about the Datacon 8800 CHAMEO advanced are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Datacon 8800 CHAMEO advanced are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Datacon 8800 CHAMEO advanced are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Datacon 8800 CHAMEO advanced are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Datacon 8800 CHAMEO advanced are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Datacon 8800 CHAMEO advanced is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
- [2]https://exhibitorsearch.messefrankfurt.com/images/original/userdata/bata/192984/5e39328ab8f46.pdf — exhibitorsearch.messefrankfurt.comexhibitorsearch.messefrankfurt.com
- [3]besi.com — besi.combesi.com
- [4]semiconductor.directory — semiconductor.directorysemiconductor.directory
Last updated Oct 10, 2026.
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