Disco
DAD3221
The Disco DAD3221 is an automatic dicing saw. The Disco DAD3221 supports substrates up to 150 mm diameter. The Disco DAD3221 includes non-contact setup, a blade breakage detector, circle cut capability, CO2 injection, pattern recognition, and automatic micro-alignment.[1][2][3]
What it is
How it works
The DAD3221 includes non-contact setup, blade breakage detection, circle cut functions for edge trimming or downsizing, a carbon dioxide injector to reduce particle adhesion and electrostatic discharge damage, pattern recognition, and automatic micro-alignment.[1][3][2]
The DAD3221 uses image-recognition functions such as auto alignment, auto focus, and auto kerf check, and it supports SECS or GEM communication control.[2]
Where it fits in the process flow
The DAD3221 prepares diced pieces for packaging and assembly workflows.[4]
Applications
What do the numbers mean?
Power & electrical2
Wafer handling3
Optics & imaging2
Performance2
Dimensions & facilities2
Configuration & options11
- Particle/ESD mitigation
- CO2 injector to prevent particle adhesion and electrostatic discharge damage[1]
What replaced it?
Related models
- siblingDisco DAD321— listed on the same source page as another automatic dicing sawsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What workpiece size does the DAD3221 support?
The DAD3221 processes workpieces up to six inches as a standard capability, and one hundred fifty millimeter by one hundred fifty millimeter workpieces with a user-specified configuration.[2][5]
What setup and alignment features are included?
The DAD3221 includes non-contact setup, pattern recognition, automatic micro-alignment, auto alignment, auto focus, and auto kerf check.[1][3][2]
What functions help protect the wafer during cutting?
The DAD3221 includes a blade breakage detector, a carbon dioxide injector to prevent particle adhesion and electrostatic discharge damage, and circle cut capability for edge trimming or downsizing.[1][3]
Does the DAD3221 support factory communication integration?
The DAD3221 supports SECS or GEM and supports communication control as an option.[2]
Not publicly documented
The following facts about the DAD3221 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD3221 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAD3221 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAD3221 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DAD3221 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DAD3221 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]epfl.ch — epfl.chepfl.ch
- [2]disco.com.sg — disco.com.sgdisco.com.sg
- [3]epfl.ch — epfl.chepfl.ch
- [4]https://mmf.montana.edu/documents/equipment-operating-manuals/DISCO%20DAD3221%20Dicing%20Saw-Accessible.pdf — mmf.montana.edummf.montana.edu
- [5]Disco-DAD3221 | AUROTECH CORPORATION — aurotech.comaurotech.com
- [6]Packaging – Miscellaneous ‒ Center of MicroNanoTechnology CMi ‐ EPFL — epfl.chepfl.ch
Last updated Oct 9, 2026.
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