Disco
DAD321
The Disco DAD321 is an automatic dicing saw. The Disco DAD321 handles 100 mm and 150 mm wafers. The Disco DAD321 can cut silicon, glass, and pyrex materials.[1][2]
Plate 01Disco DAD321 6" Dicing Saw Video 1
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What it is
The Disco DAD321 is an automatic dicing saw used for singulation of wafers and substrates. The DAD321 is classified as an automatic dicing saw. The tool is capable of cutting wafers as large as 150 mm (6 inches) in diameter. The DAD321 can process silicon, glass, and pyrex wafers. The saw can also process other materials upon request.[1][2]
How it works
The DAD321 can process wafers up to a maximum thickness of 2 mm. Silicon wafers processed by the DAD321 have a maximum thickness of 1 mm. Glass and pyrex wafers processed by the DAD321 have a maximum thickness of 2.4 mm.[1]
Where it fits in the process flow
General reference — not yet source-verifiedThe DAD321 dicing saw performs the singulation step that separates individual chips from a processed wafer. The saw is used in the packaging phase of semiconductor and microelectromechanical systems (MEMS) fabrication. Dicing is a post-processing step performed after wafer-level fabrication such as lithography, etching, and thin-film deposition is complete. Dicing separates the individual devices so they can be further packaged or directly used.
What do the numbers mean?
Wafer handling6
Configuration & options9
What replaced it?
Related models
- siblingDisco DAD3221— listed on the same source page as another automatic dicing sawsource[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kind of blades does a dicing saw use?General reference — not yet source-verified
Dicing saws typically use resin-bonded or metal-bonded diamond blades, often called hub blades or wheel blades. The blade's grit size and bonding type are chosen based on the material being cut—softer materials require different specifications than hard, brittle ones.
How does the machine handle wafer alignment?General reference — not yet source-verified
Machines of this class use an optical vision system—typically a microscope and camera—to detect alignment marks or circuit patterns on the wafer. The system then adjusts the cutting path to compensate for any rotational or translational offset of the wafer on the chuck.
Can the DAD321 cut wafers of different diameters?General reference — not yet source-verified
Dicing saws are generally designed to accommodate a range of wafer sizes through interchangeable chuck tables or frame holders. The specific maximum and minimum wafer sizes depend on the model's configuration, but class-level machines support multiple standard sizes.
What maintenance does a dicing saw require?General reference — not yet source-verified
Routine maintenance includes cleaning the chuck and spindle, replacing or dressing the blade, checking the water filtration system, and calibrating the vision system. Spindle bearings may require periodic replacement depending on usage.
Is the DAD321 suitable for cutting fragile materials like glass or ceramics?General reference — not yet source-verified
Yes, dicing saws of this class are commonly used for hard, brittle materials such as glass, ceramics, and compound semiconductors. Proper blade selection and cutting parameters (feed rate, spindle speed, depth of cut) are critical to avoid chipping or cracking.
Not publicly documented
The following facts about the DAD321 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD321 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAD321 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAD321 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DAD321 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DAD321 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]epfl.ch — epfl.chepfl.ch
- [2]ncf.uic.edu — ncf.uic.eduncf.uic.edu
- [3]Packaging – Miscellaneous ‒ Center of MicroNanoTechnology CMi ‐ EPFL — epfl.chepfl.ch
Last updated Oct 3, 2026.
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