Waferpedia

Disco

DAD 3230 Automatic Dicing

Dicing & GrindingDisco DAD family
Research Quality: 40% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Disco DAD 3230 Automatic Dicing is an automatic dicing saw. The Disco DAD 3230 supports 150 mm wafer workpieces. The Disco DAD 3230 operates on a 200V, three-phase, 50/60 Hz electrical supply.[1][2]

DAD 3230 Automatic Dicing — Inventory photo
Fig. 01DAD 3230 Automatic DicingInventory photo[1]

Power

3 Phase[1]

Optics

7.5x[4]

What it is

The Disco DAD 3230 is an automatic dicing saw in the dicing and grinding equipment class. The model is a single-spindle machine for separating workpieces by sawing, and the DAD 3230 designation identifies this specific Disco dicing platform.[1][3]

What do the numbers mean?

Power & electrical4

Phase
3 Phase[1]
Accurate?
50/60 Hz[1]
Accurate?
Voltage
200V[1]
Accurate?
Spindle power
1.5 kW[4]
Accurate?

Wafer handling1

Wafer size
150 mm (Φ150 mm)[3]
Accurate?

Optics & imaging1

Objective lens
7.5x[4]
Accurate?

Performance1

Automatic functions
Auto-alignment, auto-focus, auto-kerf check[2]
Accurate?

Configuration & options3

OEM
Disco[1]
Accurate?
Category
Dicing & Grinding[2]
Accurate?
Spindle lock
Shaft lock function for easier blade changing[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Phase3 Phase[1]
  • Configuration50/60 Hz[1]
  • Voltage200V[1]
  • Spindle power1.5 kW[4]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What is the Disco DAD 3230?

It is an automatic dicing saw.[1][5]

What model is identified?

The model is DAD 3230.[1][5]

Not publicly documented

The following facts about the DAD 3230 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD 3230 Automatic Dicing are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the DAD 3230 Automatic Dicing are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the DAD 3230 Automatic Dicing are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DAD 3230 Automatic Dicing are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the DAD 3230 Automatic Dicing is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
  3. [3]web.archive.org — disco.co.jp (May 12, 2026)web.archive.org
  4. [4]waferpedia.comwaferpedia.com
  5. [5]Equipment inventory listing
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Last updated Oct 3, 2026.

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