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18 D SurfaceversusDAD 3230 Automatic Dicing

Blanchard 18 D Surface, Disco DAD 3230 Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DAD
Specifications
Voltage416 V[1]200V[3]
Phase3 Phase[1]3 Phase[3]
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[1]—
Model18 D[1]—
Asset #153970[1]—
Power416 V, 3 phase[1]—
Configuration—50/60 Hz[3]
OEM—Disco[3]
Category—Dicing & Grinding[4]
Wafer size—150 mm (Φ150 mm)[5]
Spindle power—1.5 kW[6]
Objective lens—7.5x[6]
Automatic functions—Auto-alignment, auto-focus, auto-kerf check[4]
Spindle lock—Shaft lock function for easier blade changing[4]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com
  5. [5]web.archive.orgweb.archive.org
  6. [6]waferpedia.comwaferpedia.com