CyberOptics
SE 300 Ultra SPI
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The CyberOptics SE 300 Ultra SPI is a solder paste inspection system. The CyberOptics SE 300 Ultra SPI is categorized as metrology and inspection equipment.[1][2]
What it is
The CyberOptics SE 300 Ultra SPI is a solder paste inspection (SPI) system manufactured by CyberOptics.[1]
How it works
General reference — not yet source-verifiedSPI systems typically measure the height, area, volume, and shape of solder paste deposits using non-contact optical techniques, such as structured-light projection or laser triangulation, to generate a three-dimensional profile of the paste.
The CyberOptics SE 300 Ultra SPI applies sensor technology to capture detailed measurements of paste deposits, enabling detection of defects such as insufficient paste, excess paste, bridging, or misregistration.
Where it fits in the process flow
General reference — not yet source-verifiedThe SE 300 Ultra SPI is positioned in the SMT assembly process immediately after solder paste printing (screen printing) and before component placement by pick-and-place machines.
By inspecting every printed board, the system provides real-time feedback to the printer to correct paste volume or alignment issues, thereby reducing downstream rework and improving first-pass yield.
Applications
General reference — not yet source-verifiedThe primary application of the CyberOptics SE 300 Ultra SPI is the inspection of solder paste printed on bare printed circuit boards in high-volume surface-mount assembly lines.
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
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Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the SE 300 Ultra SPI are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the SE 300 Ultra SPI are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SE 300 Ultra SPI are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SE 300 Ultra SPI are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SE 300 Ultra SPI are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SE 300 Ultra SPI are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]SE 300 Ultra SPI — CyberOptics | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Sep 30, 2026.
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