Waferpedia

Bruker

Tesp

Test & ProbeBruker Tesp family
Research Quality: 10% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

BrukerTesp
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Power

Nominal 320 kHz[3]

Optics

Nominal 7 nm[3]

What is it?

What do the numbers mean?

Power & electrical1

Frequency
Nominal 320 kHz[3]
Accurate?

Optics & imaging1

Tip radius
Nominal 7 nm[3]
Accurate?

Dimensions & facilities1

Width
Nominal 40 µm[3]
Accurate?

Configuration & options7

Equipment type
Test & Probe[1]
Accurate?
Model
Tesp[2]
Accurate?
Asset description
Prober[2]
Accurate?
Variant designation
TESP-V2[3]
Accurate?
Geometry
Rectangular[3]
Accurate?
Spring constant
Nominal 37 N/m[3]
Accurate?
Length
Nominal 123 µm[3]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
TESP-V2——Probe part numbers ending in -V2 provide tighter dimensional specifications, more precise alignment of the tip to the cantilever apex, and improved aesthetics.brukerafmprobes.com[3]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • FrequencyNominal 320 kHz[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the Bruker Tesp?

The Bruker Tesp is a semiconductor wafer prober.[2]

Not publicly documented

The following facts about the Tesp are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Tesp are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the Tesp are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Tesp are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Tesp is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the Tesp are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]brukerafmprobes.com — brukerafmprobes.combrukerafmprobes.com
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Last updated Oct 7, 2026.

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