ASM
Dragon 2300
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ASM Dragon 2300 is a plasma-enhanced chemical vapor deposition (PECVD) system for thin film deposition in semiconductor wafer fabrication.[1][2]
What it is
The ASM Dragon 2300 is a plasma-enhanced chemical vapor deposition (PECVD) system used in semiconductor manufacturing.[1][2]
How it works
General reference — not yet source-verifiedIn a PECVD process, reactive gases are flowed into a chamber where a radio-frequency (RF) field generates a plasma.
The plasma creates energetic electrons that dissociate the gaseous precursors into reactive radicals, which then adsorb and react on the wafer surface to form a solid film.
Where it fits in the process flow
General reference — not yet source-verifiedPECVD systems such as the Dragon 2300 are typically employed in the back-end-of-line (BEOL) portion of semiconductor fabrication, where they deposit interlayer dielectrics, passivation layers, and etch-stop layers.
The deposition step follows wafer cleaning and precedes planarization or lithography.
Applications
General reference — not yet source-verifiedCommon applications for the Dragon 2300 include the deposition of silicon dioxide, silicon nitride, silicon oxynitride, and other dielectric films used for insulation, sidewall spacers, and stress liners.
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
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Not publicly documented
Field notes
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Frequently asked questions
What type of deposition technology does the ASM Dragon 2300 use?
The ASM Dragon 2300 uses plasma-enhanced chemical vapor deposition (PECVD).[1][2]
What is the equipment category of the ASM Dragon 2300?
The ASM Dragon 2300 is categorized as deposition equipment.[3]
Is the ASM Dragon 2300 used for thin film deposition?
Yes, the ASM Dragon 2300 is a thin film deposition equipment.[2]
Not publicly documented
The following facts about the Dragon 2300 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the Dragon 2300 are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Dragon 2300 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Dragon 2300 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Dragon 2300 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Dragon 2300 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]High-Precision Semiconductor Wafer Fab Equipment Asm Dragon 2300 Pecvd Thin Film Deposition Equipment - Thin Film Deposition Equipment and Wafer Thin Film Deposition Equipment — hongdesen168.en.made-in-china.comhongdesen168.en.made-in-china.com
- [3]Dragon 2300 — ASM | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 1, 2026.
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