AJA

A300

Deposition up to 6 in diameter AJA A300 family

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AJAA300

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Plate 01A300 with 270 deg dies
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Plate 02The A300 Vs The A350 – How Airbus’ Oldest Aircraft Compares To Its Newest
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What it is

General reference — not yet source-verified

Magnetron sputtering sources generate a plasma near a target so atoms can be ejected from the target and deposited onto a substrate. A sputtering source of this class is typically mounted in a deposition chamber and used for thin-film coating, multilayer growth, and composition control.

How it works

The A300-XP-O source uses a compact magnetron design with tunable isolation chimneys, gas injection, and flip-top shutters. The magnet array can be configured for balanced, unbalanced, and magnetic-material modes.^[1]^[2]^[3]

What can it run?

Process applications and technology nodes documented for this tool.

sputtering

What do the numbers mean?

Wafer handling2

Substrate size: up to 6 in diameter^[1]
Wafer size: up to 6 in diameter^[1]

Configuration & options9

Source family: A300 Series modular magnetrons^[1]
Use in systems: used in Orion-series sputtering systems^[1]
Target sizes: 2 in and 3 in^[1]
System environment: HV and UHV^[1]
Temperature range: cooled LN2 to 1000 C^[1]
Magnet array modes: nearly-balanced, unbalanced, and magnetic material modes^[1]
OEM: AJA^[1]
Model: A300^[1]
Category: Deposition^[1]

Vintage & configurations

Documented models & variants

Designation	Generation	Vintage	Changes	Source
A300-XP	—	—	UHV magnetron sputtering source in 2-inch and 3-inch sizes	web.archive.org^[1]
A300-XP-O	—	—	UHV magnetron sputtering source designed specifically to fit cluster flanges for compact Orion systems; 2-inch and 3-inch target sizes	web.archive.org^[1]

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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What types of target materials can be used in sputter deposition?General reference — not yet source-verified

Sputter deposition can use a wide range of conductive and non‑conductive materials, including metals, alloys, oxides, nitrides, and semiconductors. Both DC and RF power supplies are available to handle conductive and insulating targets, respectively.

How is film thickness controlled in a sputter deposition system?General reference — not yet source-verified

Film thickness is typically controlled by adjusting deposition parameters such as sputtering power, process gas pressure, substrate-to-target distance, and deposition time. Many systems incorporate quartz crystal microbalances or optical endpoint detection for in‑situ thickness monitoring.

What substrates can be coated using such a system?General reference — not yet source-verified

Substrates commonly include semiconductor wafers (silicon, compound semiconductors), glass, quartz, metal foils, and flexible polymers. The substrate holder often provides rotation and heating to improve uniformity and film quality.

Can sputter deposition produce compound or alloy films?General reference — not yet source-verified

Yes. By using a compound target or reactive sputtering with a gas (e.g., nitrogen or oxygen), compound films can be deposited. Alloy or multilayer films can be co‑sputtered from multiple targets or by sequential deposition from individual targets.

Not publicly documented

The following facts about the A300 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the A300 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the A300 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the A300 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the A300 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the A300 are on record.
Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (3)Every fact above is drawn from these public sources

[1]web.archive.org — web.archive.orgweb.archive.org
[2]ATC Orion Series Sputtering Systems — web.archive.orgweb.archive.org
[3]ATC Orion Sputtering Systems - AJA International, Inc. — web.archive.orgweb.archive.org