Manufacturer
Finetech
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9 entries
- Fineplacer LambdaFinetech
The Finetech Fineplacer Lambda is a sub-micron die bonder used for precise placement and bonding of components onto substrates.
CategoryPackaging & Bonding - Fineplacer CRS 10 Compact ReworkFinetech
The Finetech Fineplacer CRS 10 is a compact rework system.
- SigmaFinetech
The Finetech Sigma is a sub-micron placement accuracy die bonder capable of handling substrates up to 300 mm with bonding forces up to 1000 N.
CategoryPackaging & Bonding - TL 300Finetech
- A 800FinetechCategoryPackaging & Bonding
- Fineplacer Lambda Sub MicronFinetech
Finetech Fineplacer Lambda Sub Micron is a die bonder with 0.5 µm accuracy and options including a bonding force module, chip heating module, and dispensing module.
CategoryPackaging & Bonding - A 4 V HD 700Finetech
The Finetech A 4 V HD 700 is a semi-automatic bonder capable of thermocompression and thermosonic bonding.
CategoryPackaging & Bonding - LambdaFinetech
Finetech Lambda is a die bonder with sub-micron placement accuracy, supporting thermocompression and ultrasonic bonding.
CategoryPackaging & Bonding - Fineplacer 96Finetech
The Finetech Fineplacer 96 is a die bonder with optional modules including flip chip, epoxy dispenser, pick & place, UV curing, heat plate, wafer ring holder, accessories, and isolated table.
CategoryPackaging & BondingWaferWafer Ring Holder,
