Tool family
Koh Young’s 3D AOI line uses True 3D technology for inspection of components, solder joints, patterns, and foreign material on assembled PCBs.
Koh Young’s 3D AOI line uses True 3D technology for inspection of components, solder joints, patterns, and foreign material on assembled PCBs.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Zenith 2 | 3D AOI | — | Flagship AOI model with 3D side-view cameras to expand inspection coverage. | web.archive.org[1] |
| Zenith UHS | 3D AOI | — | — | web.archive.org[1] |
| Zenith | 3D AOI | — | — | web.archive.org[1] |
| Zenith F | 3D AOI | — | — | web.archive.org[1] |
| Zenith Alpha | 3D AOI | — | — | web.archive.org[1] |
| Zenith LiTE | 3D AOI | — | — | web.archive.org[1] |
| Zenith S | 3D AOI | — | — | web.archive.org[1] |
| KY8030-2 | — | — | Inspects from 11.1 to 59.5 cm²/sec to a paste height of 450 microns, with resolutions of 10, 15, 20 or 25 microns. | kohyoungamerica.com[2] |
| KY8030-3 | — | — | Roughly twice the throughput of KY8030-2, reaching 81.85 cm²/sec at 8 megapixel and 20 microns, to a 400 micron inspection height. Also inspects conductive glue and sinter paste. | kohyoungamerica.com[2] |
| KY8030 USX | — | — | Extended-length configuration of KY8030-3, for boards up to 1,300 mm in a single pass, optionally 1,800 mm. Same measurement performance as KY8030-3. | kohyoungamerica.com[3] |