Tool family
Esec 2100 sD advanced i
The Esec 2100 sD advanced i is a die bonder for epoxy die attach applications. The Esec 2100 sD advanced i is described as a 3rd generation 300 mm high speed platform with 20 µm bonding accuracy and an optional 15 µm placement accuracy in High Accuracy Mode.
Models in this family
- 2100 sD advanced i3rd generation
The Esec 2100 sD advanced i is a die bonder for epoxy die attach applications. The Esec 2100 sD advanced i is described as a 3rd generation 300 mm high speed platform with 20 µm bonding accuracy and an optional 15 µm placement accuracy in High Accuracy Mode.
