Waferpedia

Comparison ledger

Concept One 150versusConcept One 150 PECVD-TEOS

Lam Research Concept One 150, Lam Research Concept One 150 PECVD-TEOS, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Concept One 150Lam Research
OEMLam ResearchLam Research
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research Concept One 150Lam Research Concept One 150
Specifications
ConfigurationTEOS[1]Si 02 / TEOS[5]
Frame TypeC1-150[3]—
Process TypesSiO2, SiN, Nitride[3]—
ChamberDielectric[3]—
Cassette PlatformC1 150mm[3]—
Front, Side MonitorsLCD[3]—
Wafer Size6 inch[1]6 inch[5]
Process Type (SiO2)SiO2[3]—
Process Type (SiN)SiN[3]—
Process Type (Nitride)Nitride[3]—
Chamber Type (Dielectric)Dielectric[3]—
Chamber Type (Tungsten)Tungsten[3]—
RobotSingle Arm[3]—
Monitor TypeLCD[3]—
CommunicationSECS / GEMS[3]—
Micro Contamination OptionYes[3]—
Heated ValvesYes[3]—
MonitorsFront and side LCD[3]—
InterfaceSECS/GEMS[3]—
Phase—3 Phase[5]
Voltage—208 Vac[5]
Process—PECVD-TEOS (Plasma-Enhanced Chemical Vapor Deposition - Tetraethyl Orthosilicate)[5]
Current—100 Current[5]
Deposition Material—Si 02 / TEOS (Silicon Dioxide / Tetraethyl Orthosilicate)[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing