Comparison ledger
EV Group 101, SUSS MicroTec MA/BA6, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | MA/BA6SUSS MicroTec |
|---|---|---|
| OEM | EV Group | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | SUSS MicroTec MA/BA6 |
| Cited variants | — | |
| Specifications | ||
| OEM | EV Group[3] | — |
| Model | 101[3] | — |
| Equipment name | EVG 101 Spray Coater[3] | — |
| NEMO ID | evgspraycoat[3] | — |
| Training required | EVG 101 Training[3] | — |
| Training duration | 1.50 hours[3] | — |
| Processing technique | Resist Spray Coat (manual)[3] | — |
| Cleanliness | "All"[3] | — |
| Location | SNF Paul G Allen L107 Cleanroom[3] | — |
| Wafer diameter (substrate size) | up to 300 mm[4] | — |
| Available modules | Spin coat / OmniSpray® / develop[4] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[4] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[4] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[5] | — |
| Cleanliness group (at SNF) | "All"[3] | — |
| Type | — | Contact aligner[6] |
| Application | — | Broadband lithography[6] |
| Alignment capability | — | Backside alignment capability[6] |
| Exposure wavelengths | — | g-line (436 nm), h-line (405 nm), i-line (365 nm), UV broadband (350-450 nm)[1] |
| Illumination area | — | 150 mm diameter[1] |
| Resolution (standard) | — | 1 µm[1] |
| Resolution (best) | — | 0.6 µm in vacuum contact mode[2] |
| Topside overlay accuracy | — | 500 nm[1] |
| Backside overlay accuracy | — | 1000 nm[1] |
| Maximum wafer diameter | — | 150 mm (6 in)[1] |
| Substrate sizes | — | 1" to 150 mm diameter[7] |
| Mask sizes | — | 2.5" x 2.5" to 7" x 7"[7] |
| Maximum substrate thickness | — | 10 mm[7] |
| Lamp | — | 350 W mercury lamp[2] |
| Exposure modes | — | vacuum contact, hard contact, soft contact[2] |
| i-line band pass filter | — | removable[2] |
| Alignment accuracy | — | 0.25 - 0.5 µm[2] |
| Backside alignment | — | Yes[6] |
| Tool type | — | Contact aligner[6] |
| Alignment modes | — | Frontside and backside alignment[1] |
| Resolution | — | 1 µm[1] |
| Top side overlay accuracy | — | 500 nm[1] |
| Mask sizes supported | — | 127 mm x 127 mm (5 in.) and 178 mm x 178 mm (7 in.)[1] |
| Substrate thickness | — | 10 mm maximum substrate thickness[7] |
| Feature size | — | Down to 0.6 µm[2] |
| Exposure area | — | 6 in. diameter exposure area[2] |
| Light source | — | 350 W mercury lamp[2] |
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