Comparison ledger
EV Group 101, SUSS MicroTec ACS 200 Gen 3, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | ACS 200 Gen 3SUSS MicroTec |
|---|---|---|
| OEM | EV Group | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | SUSS MicroTec ACS 200 |
| Cited variants | — |
|
| Specifications | ||
| OEM | EV Group[2] | — |
| Model | 101[2] | — |
| Equipment name | EVG 101 Spray Coater[2] | — |
| NEMO ID | evgspraycoat[2] | — |
| Training required | EVG 101 Training[2] | — |
| Training duration | 1.50 hours[2] | — |
| Processing technique | Resist Spray Coat (manual)[2] | — |
| Cleanliness | "All"[2] | — |
| Location | SNF Paul G Allen L107 Cleanroom[2] | — |
| Wafer diameter (substrate size) | up to 300 mm[3] | — |
| Available modules | Spin coat / OmniSpray® / develop[3] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[3] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[3] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[4] | — |
| Cleanliness group (at SNF) | "All"[2] | — |
| Set-up Transformer | — | 50 Hz Compatible Model[5] |
| Cassette Stations (4) | — | Compatible with Open Cassettes[5] |
| Wafer Transfer System | — | Dual-Arm (Nidec Sankyo) End Effector[5] |
| Pre-Aligner | — | Equipped with Orientation flat/notch postition rotation for both opague (Si water) & transparent (glass water)substrates[5] |
| Configuration | — | Bake Plate (8):[5] |
| Temp | — | 60-250 Deg C[5] |
| Vintage | — | 2019 |
| Coaters & Developers Vintage | — | 2019 |
| - # of develop line each bowl | — | 2:DEV (binary , fan spray), 2: DI (binary, fan spray), 1:N2 |
| Wafer Sizes | — | 2, 3, 4, 5, 6, 8, 12 inch[5] |
| Max Wafer Size (product detail) | — | up to 8 inch[5] |
| Cassette Stations | — | 4 (compatible with Open Cassettes)[5] |
| Bake Plates | — | 8, supports proximity bake, temperature 60-250 °C[5] |
| Cool Plates | — | 3, temperature 18-25 °C, proximity supported[5] |
| Configuration (variant) | — | Coater/Developer with 4 developers, 4D setup[1] |
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