Waferpedia

Comparison ledger

Dektak 150versusDektak 8versusDektak XT

Bruker Dektak 150, Bruker Dektak 8, Bruker Dektak XT, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Dektak 8Bruker
Dektak XTBruker
OEMBrukerBrukerBruker
CategoryMetrology & InspectionMetrology & InspectionMetrology & Inspection
Wafer size——2 in, 4 in, 6 in, 8 in
Process node———
Introduced———
Production run———
Lifecycle———
Lifecycle milestones———
Control system———
Generation———
FamilyBruker DektakBruker DektakBruker Dektak
Specifications
Configurationfor parts[1]Chambers (2)[3]4" Stage and movement controlled by software[5]
Scan Length55mm (2.16in.)[2]——
Data Points Per Scan60,000 maximum[2]——
Step Height Repeatability6Å, 1 sigma on 1μm step[2]——
Vertical Resolution1Å max. (at 6.55μm range)[2]——
Max Sample ThicknessUp to 100mm (4in.)[2]——
Max Sample Size150mm (6in.)[2]——
Stage Travel100mm (4 inches)[2]——
Stage Repeatability1μm[2]——
Stage Resolution0.5μm[2]——
Stylus Radius Optionsfrom 50nm to 25μm[2]——
Camera640 x 480-pixel, manual zoom variable 0.67 to 4.29mm (644X to 100X with 17in. monitor)[2]——
Maximum scan length55mm (2.16in.)[2]50 mm[4]—
Maximum data points per scan60,000[2]——
Maximum sample thicknessUp to 100mm (4in.)[2]——
Maximum sample size150mm (6in.)[2]8 inches[4]—
Y automatic stage travel100mm (4 inches), 1μm repeatability, 0.5μm resolution[2]——
Film thickness measurement rangeup to 1000μm[2]——
Type—Contact profilometer[4]stylus surface profiler[6]
Vertical step range—Tens of nanometers to 1 mm[4]—
Stylus diameter——12.5 Microns[5]
Measurement type——Stylus surface profiler for thin and thick film step height[6]
Wafer compatibility——2 in, 4 in, 6 in, 8 in[6]
Magnification / Field of View——Selectable 1 to 4 mm FOV[6]
Scan length range——55 mm (with stitching option)[6]
Vertical range——1 mm[6]
Step-height repeatability——5 Å[6]
Low force (N-Lite+)——0.03 to 15 mg[6]
3D capabilities——3D stress and 3D mapping[6]
Compatible wafer sizes——2", 4", 6", 8"[6]
Selectable magnification——1 to 4mm FOV[6]
N-Lite+ Low Force——0.03 to 15mg[6]
3D stress and 3D mapping——Supported[6]
Tool Type——Stylus surface profiler[6]
Wafer Compatibility——2″, 4″, 6″, 8″ wafers[6]
Field of View Magnification——Selectable, 1 to 4mm FOV[6]
Measurement purpose——advanced thin and thick film step height measurement[6]
Low force mode——N-Lite+ Low Force with 0.03 to 15mg[6]
Measurement modes——3D stress and 3D mapping[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]smif.pratt.duke.edusmif.pratt.duke.edu
  3. [3]inventory listing
  4. [4]cmdis.rpi.educmdis.rpi.edu
  5. [5]inventory listing
  6. [6]epfl.chepfl.ch