Comparison ledger
Applied Materials Mirra Mesa, Applied Materials Mirra Mesa CMP 5201, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Mirra MesaApplied Materials | Mirra Mesa CMP 5201Applied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | CMP | CMP |
| Wafer size | — | Wafer loss sensor |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Mirra Mesa | Applied Materials Mirra Mesa |
| Cited variants |
| — |
| Specifications | ||
| CMP Model | Mirra Mesa[2] | — |
| Process | OX[2] | — |
| Polisher System Module | 4 Head 3 Platen[2] | — |
| Configuration | Platen 1 configuration:[2] | Oxide, W[3] |
| Platen 1 Type | With window, belt + gear CVT[2] | — |
| Platen 1 endpoint | Full scan and motor torque[2] | — |
| Platen 1 slurry arm | Standard tunable[2] | — |
| Platen 1 pad conditioner arm | Standard[2] | — |
| Platen 2 Type | With window, belt + gear CVT[2] | — |
| Platen 2 endpoint | Full scan[2] | — |
| Platen 2 slurry arm | Standard tunable[2] | — |
| Platen 2 pad conditioner arm | Standard[2] | — |
| Platen 3 Type | With window, belt + gear CVT[2] | — |
| Platen 3 endpoint | Full scan[2] | — |
| Platen 3 slurry arm | Standard tunable[2] | — |
| Platen 3 pad conditioner arm | Standard[2] | — |
| Polishing head | 3 zone[2] | — |
| Slurry Delivery | 2 types of slurry[2] | — |
| Model | Mirra Mesa[2] | Mirra Mesa CMP 5201[3] |
| Category | CMP (Chemical Mechanical Polisher)[2] | — |
| Slurry flow rate control | Peristaltic pump[2] | — |
| FABs port | 3 Port[2] | — |
| Electrical requirements | 50/60 HZ; 200-230V; three-phase four-wire[2] | — |
| Cleaner quantity | 1 unit[2] | — |
| Cleaner robot | working beam Megasonics Module[2] | — |
| Cleaning method | Vertical[2] | — |
| Megasonics delivery type | 2 Chem flow meter type[2] | — |
| Brush 1 clean | 1 Chem and DIW[2] | — |
| Brush 1 flow type | flow meter type[2] | — |
| Brush 2 clean | 1 Chem and DIW[2] | — |
| Brush 2 flow rate | flow meter type[2] | — |
| Dry type | Spin Dryer[2] | — |
| Drying | Lamp heater Drying; N2 Drying[2] | — |
| Line Frequency | 50/60 HZ[2] | — |
| OEM | Applied Materials[2] | Applied Materials[3] |
| Facilities option | EMO Guard Ring[2] | — |
| Line voltage | 200-230V[2] | — |
| Connection | Three-phase four-wire[2] | — |
| Power lamp | Green Lamp[2] | — |
| Power connected lamp | Power Connected Lamp[2] | — |
| GFI type | STANDARD 30mA[2] | — |
| Cassette | — | 25 slots[3] |
| Tower Lamp | — | 4 colors[3] |
| Cross Arm | — | side to side on robot plate, 270±0.1*[3] |
| Motor | — | Yaskawa[3] |
| Wafer size | — | Wafer loss sensor[3] |
| Equipment type | — | Polisher[3] |
| Process configuration | — | Oxide, Dry In / Dry Out[3] |
| Cassette type | — | Open type cassette / 4 ports[3] |
| Cassette capacity | — | 25 slots[3] |
| Wafer loss sensor | — | Present[3] |
| HCLU platen size | — | 20 inch (3)[3] |
| Platen motor | — | Yaskawa (3)[3] |
| Platen speed | — | 1,2,3 ±5% (10–150 rpm)[3] |
| Platen temperature control | — | Present[3] |
| Dual wafer loss sensor with temp monitoring | — | Present (4)[3] |
| ISRM module type | — | Present (3)[3] |
| Upper platen coating | — | Teflon coating (3)[3] |
| Polish head size | — | 8 inch (4)[3] |
| Polish head rotation motor | — | NSK motor (4)[3] |
| Polish head speed | — | ±5% (10–120 rpm)[3] |
| Polish head vacuum | — | Membrane vacuum ±10%, upgraded vacuum eject system[3] |
| Polish head action | — | Programmable & auto action for heads 1–4[3] |
| Water fall type | — | Configured[3] |
| Rotary union | — | 3 port / zone type[3] |
| Head sweep | — | Standard head sweep, oriental motor[3] |
| Pad conditioner | — | 1 per platen (3), screw type, universal disk holder[3] |
| Slurry arm | — | Dual line output type delivery (3)[3] |
| Polisher lower | — | Malema flow meter type (6)[3] |
| Rotation motor | — | NSK motor (4)[3] |
| Head 1,2,3,4 speed | — | ±5%(10~120 rpm)[3] |