Comparison ledger
Applied Materials 0720 06060 Part, Cascade Microtech Summit 11000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0720 06060 PartApplied Materials | Summit 11000Cascade Microtech |
|---|---|---|
| OEM | Applied Materials | Cascade Microtech |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0720 06060 Part | Cascade Microtech Summit 11000 |
| Specifications | ||
| Configuration | Contact Pin 24-20 Awg Crimp Gold Flash[1] | — |
| Z-lift range | — | 5.5 mm linear lift with <2 µm repeatability[2] |
| X-Y stage travel | — | 203 mm × 203 mm[2] |
| X-Y resolution | — | 0.2″ per turn[2] |
| Wafer Size | — | 8 inch (200mm)[2] |
| X-Y Stage Resolution | — | 0.2 inch per turn[2] |
| Z-lift Range | — | 5.5 mm linear lift[2] |
| Z-lift Repeatability | — | < 2 μm[2] |
| Maximum Frequency (RF) | — | 110 GHz[3] |
| Wafer Chuck | — | 6-inch/150mm RF/Microwave chuck (Ni)[4] |
| X-Y Stage Resolution (alternative) | — | 0.1 μm resolution[4] |
| Z Travel | — | 5mm with 1 μm resolution[4] |
| Bridge Travel (X) | — | 6-inch X axis travel (+/- 3-inch from center of travel)[4] |
| Bridge Travel (Y) | — | 8-inch Y axis travel (+/- 4-inch from center of travel)[4] |
| Bridge Z-lift | — | 3-inch linear manual Z-lift[4] |
| Supported wafer size | — | 8 inch (200 mm)[2] |
| X-Y stage resolution (manual) | — | 0.2″ per turn[2] |
| X-Y travel resolution | — | 0.1 µm[4] |
| Large area bridge X travel | — | 6 inch[4] |
| Large area bridge Y travel | — | 8 inch[4] |
| Large area bridge Z-lift | — | 3 inch linear manual[4] |
| Maximum on-wafer RF frequency | — | 110 GHz[3] |
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