Comparison ledger
Applied Materials 0010 47763, Lam Research 4520 i Oxide, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | 4520 i OxideLam Research |
|---|---|---|
| OEM | Applied Materials | Lam Research |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Lam Research Rainbow 4520 |
| Specifications | ||
| Configuration | 2nd Source New[1] | Bulkhead system mount w/tunnel covers[4] |
| Type | Monopolar Dual Heated[2] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Model | 0010-47763[1] | 4520 i[5] |
| OEM | Applied Materials[1] | — |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[2] | — |
| Quantity available (source) | 1[2] | — |
| Software Version | — | Classic 7,31-42[5] |
| Phase | — | Main Power 208V, 3 Phase, 5Wire, 175A, 60/[4] |
| Make | — | Lam[5] |
| Equipment type | — | Oxide Etcher[6] |
| Wafer size | — | 6 inch[5] |
| Clamp type | — | ESC[5] |
| System mount | — | Bulkhead system mount w/tunnel covers[5] |
| RF power | — | Rack AE PDW2200 RFG1250 13,56MHz[5] |
| Main power | — | 208V, 3 Phase, 5Wire, 175A, 60/[5] |
| Endpoint detector | — | Single lower chamber endpoint detector (405/520nm) Non-heated endpoint window[5] |
| Vacuum / pumping | — | Low pressure chamber manifold; AC--2 chamber pressure control[5] |
| Gas 1 | — | AR 375sccm[5] |
| Gas 2 | — | CF4 100 sccm[5] |
| Gas 3 | — | CHF3 50 sccm[5] |
| Gas 4 | — | He 200 sccm[5] |
| Gas 5 | — | O2 20 sccm[5] |
| Gas 6 | — | N2 200 sccm[5] |
| Gas 8 | — | He 1000sccm[5] |
| UPC | — | He (50 sccm)[5] |
| Wafer handling | — | Hine 38A open cassette Send/Receive indexers[5] |
| Gas 7 | — | NF3 500 sccm[4] |
| Applications | — | Contact etch; Planarization; Via etch; Trench mask etch; Pad etch[7] |
| System | — | Single wafer, two active processing chambers, vacuum load-locked low pressure oxide system[7] |
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