Waferpedia

Comparison ledger

10490versus7700C

West Bond 10490, West Bond 7700C, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
7700CWest Bond
OEMWest BondWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyWest Bond 10490West Bond 7700C
Cited variants—
Specifications
ManufacturerWest Bond[2]—
Model10490[2]—
DescriptionConvertible bonder, wedge to ball[3]—
Tool typeConvertible bonder[4]—
Bonding modesWedge bonding and ball bonding[4]—
UseWire bonding[4]—
bond type—thermosonic ball-wedge[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]semistarcorp.comsemistarcorp.com
  2. [2]Equipment inventory listing
  3. [3]fabsurplus.comfabsurplus.com
  4. [4]waferpedia.comwaferpedia.com