Comparison ledger
SUSS MicroTec SB 6 GEN 2, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SB 6 GEN 2SUSS MicroTec | 10490West Bond |
|---|---|---|
| OEM | SUSS MicroTec | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec SB 6 GEN 2 | West Bond 10490 |
| Specifications | ||
| Tool type | Substrate bonder[1] | Convertible bonder[5] |
| Maximum wafer diameter | 150 mm[1] | — |
| Substrate sizes | Pieces to 150 mm[1] | — |
| Minimum chamber vacuum | 5 × 10-5 bar[1] | — |
| Maximum temperature | 550 °C[1] | — |
| Maximum bonding force | 20 kN[1] | — |
| Power supply for anodic bonding | 2000 V, 60 mA[1] | — |
| Maximum thickness | 9.99 mm[1] | — |
| Automation | Semi-automated[2] | — |
| Applications | MEMS, LED, packaging, 2.5D/3D integration[2] | — |
| Manufacturer | — | West Bond[3] |
| Model | — | 10490[3] |
| Description | — | Convertible bonder, wedge to ball[4] |
| Bonding modes | — | Wedge bonding and ball bonding[5] |
| Use | — | Wire bonding[5] |
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