Comparison ledger
SUSS MicroTec ACS 200 Gen 3, Ultratech 1000 Family, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ACS 200 Gen 3SUSS MicroTec | 1000 FamilyUltratech |
|---|---|---|
| OEM | SUSS MicroTec | Ultratech |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec ACS 200 | Ultratech 1000 Family |
| Cited variants |
| — |
| Specifications | ||
| Set-up Transformer | 50 Hz Compatible Model[2] | — |
| Cassette Stations (4) | Compatible with Open Cassettes[2] | — |
| Wafer Transfer System | Dual-Arm (Nidec Sankyo) End Effector[2] | — |
| Pre-Aligner | Equipped with Orientation flat/notch postition rotation for both opague (Si water) & transparent (glass water)substrates[2] | — |
| Configuration | Bake Plate (8):[2] | — |
| Temp | 60-250 Deg C[2] | — |
| Vintage | 2019 | — |
| Coaters & Developers Vintage | 2019 | — |
| - # of develop line each bowl | 2:DEV (binary , fan spray), 2: DI (binary, fan spray), 1:N2 | — |
| Wafer Sizes | 2, 3, 4, 5, 6, 8, 12 inch[2] | — |
| Max Wafer Size (product detail) | up to 8 inch[2] | — |
| Cassette Stations | 4 (compatible with Open Cassettes)[2] | — |
| Bake Plates | 8, supports proximity bake, temperature 60-250 °C[2] | — |
| Cool Plates | 3, temperature 18-25 °C, proximity supported[2] | — |
| Configuration (variant) | Coater/Developer with 4 developers, 4D setup[1] | — |
| Tool type | — | Photolithography step-and-repeat 1X stepper[3] |
| Optical design | — | Wynne Dyson[3] |
| Magnification | — | 1X[3] |
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