Waferpedia

Comparison ledger

SE 75 D Horizontal Injectionversus10490

Sumitomo SE 75 D Horizontal Injection, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
OEMSumitomoWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySumitomo SE 75West Bond 10490
Specifications
ConfigurationPicker Machine, Auto-Gate Cutting, Conveyor, MTC & Mold[1]—
ManufacturerSumitomo[1]West Bond[3]
ModelSE 75 D[1]10490[3]
Tool typeHorizontal injection molding machine[2]Convertible bonder[5]
Configuration & optionsPicker Machine, Auto-Gate Cutting, Conveyor, MTC & Mold[2]—
Description—Convertible bonder, wedge to ball[4]
Bonding modes—Wedge bonding and ball bonding[5]
Use—Wire bonding[5]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]Equipment inventory listing
  4. [4]fabsurplus.comfabsurplus.com
  5. [5]waferpedia.comwaferpedia.com