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Comparison ledger

SE 50 D Horizontal Injectionversus10490

Sumitomo SE 50 D Horizontal Injection, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
OEMSumitomoWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySumitomo SE 50West Bond 10490
Specifications
ConfigurationFor Repair ( Screw, motor)[1]—
OEMSumitomo[3]—
ModelSE 50 D[3]10490[4]
Equipment typeHorizontal Injection Molding Machine[3]—
CategoryPackaging & Bonding[1]—
Manufacturer—West Bond[4]
Description—Convertible bonder, wedge to ball[5]
Tool type—Convertible bonder[6]
Bonding modes—Wedge bonding and ball bonding[6]
Use—Wire bonding[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]Equipment inventory listing
  4. [4]Equipment inventory listing
  5. [5]fabsurplus.comfabsurplus.com
  6. [6]waferpedia.comwaferpedia.com