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Comparison ledger

MACS ICPversus1512e

SPTS MACS ICP, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1512eTegal
OEMSPTSTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySPTS MACS ICPTegal 1512e
Cited variants—
Specifications
ConfigurationHR chamber[2]—
Clamp typestandard WTC[2]—
Coil RF powerAdvanced Energy RFG3001, 3kw[2]—
Platen RF powerENI ACG-3B 13.56MHZ, 300w[2]—
Load lock pumpEbara AAL10[2]—
Chamber pumpEbara A30W[2]—
Turbo pumpLeybold MAG2000CT[2]—
Turbo Pump ControllerLeybold MAG Drive 2000[2]—
ChillerATS/DEX-20ADI[2]—
ManufacturerSPTS / STS[2]—
ModelMACS ICP[2]—
CategoryEtch[3]—
Wafer size8 inch[2]—
ChamberHR chamber[2]—
Wafer capability6", 8" capable[2]—
Wafer handlingMACS loader for cassette to cassette operation (2 load stations)[2]—
Vacuum load lockCarousel vacuum load lock[2]—
Backside coolingHelium backside cooling (HBC)[2]—
GasesC4F8 (200 sccm); SF6 (1000 sccm); O2 (200 sccm); Ar (50 sccm)[2]—
Vintage2002[2]—
Voltage208 Volts / 60 Hz, 40 Amps/phase[1]—
Chamber quantity1 chamber[4]—
Tool type—Industrial RIE plasma etcher system[5]
Stated configuration—With modules assembly for CI-4222[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]hommer.com.twhommer.com.tw
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]challentech.com.twchallentech.com.tw
  5. [5]semistarcorp.comsemistarcorp.com