Shinkawa
UTC 5000 alternatives
Comparable Packaging & Bonding equipment documented in the Waferpedia catalog.
6 comparable tools
Palomar
8000 i
Packaging & Bonding
The Palomar 8000 i is a wire bonder and ball bumper for complex, high-mix automated production. The Palomar 8000 i is a fully automated thermosonic high-speed, ball-and-stitch wire bonder with ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles.
Kulicke & Soffa
IBond 5000
Packaging & Bonding
The Kulicke & Soffa IBond 5000 is a wire bonder with ball-wedge bonding capability.
Applied Materials
0010-47763 ASSY ESC Bonded Monopolar Dual Heated
Packaging & Bonding
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
Applied Materials
0041-26723 Bonded Assembly
Packaging & Bonding
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
Logitech
1 WBS 1 Wafer Substrate
Packaging & Bonding
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
Branson
101-149-053 Gold Booster
Packaging & Bonding
The Branson 101-149-053 Gold Booster is an ultrasonic welding horn booster that doubles the amplitude of the vibration, operating at 20 kHz.
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