Comparison ledger
Palomar 3880-II, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3880-IIPalomar | 10490West Bond |
|---|---|---|
| OEM | Palomar | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Palomar 3880-II | West Bond 10490 |
| Specifications | ||
| Processes | Silver Sintering Die Bonding; Eutectic Die Bonding; Epoxy Die Bonding; UV Die Bonding; Solder Paste Die Bonding; Thermocompression Die Bonding[1] | — |
| VisionPilot with Vision Standardization | Uses advanced geometric pattern matching to locate parts that are randomly oriented or have greyscale variations, using boundary curves not tied to a traditional pixel-grid.[1] | — |
| Automated Tool Changer | Automated access to nearly unlimited tools; up to 8 tools can be loaded in the tool turret for near-instant access.[1] | — |
| Bond Data Miner | Centralized data management and analysis system for machine and process trend monitoring, storage, traceability, cross-platform data, closed-loop process control, yields, and predictive maintenance.[1] | — |
| High Force Tool Option | Provides high force while maintaining high precision for low-force operations and tight planarity control even for very large components.[1] | — |
| Pulsed Heat Systems | Computer-controlled heating solution for solder-based applications, available in several forms including a large surface area model and a tool-incorporated heating source.[1] | — |
| Type | Automatic Die Bonder[2] | — |
| Placement Speed | 1200 UPH[2] | — |
| X Y Placement Accuracy (Repeatability) | 3.5 µm[2] | — |
| Theta Placement Accuracy | > 400 Degree[2] | — |
| Substrate Working Range | 914.4 x 508 mm[2] | — |
| Compressed Air | 4 bar[2] | — |
| Power Supply | 230 VAC, 50/60 Hz, 10A, Single Phase[2] | — |
| Overall Dimensions (W x D x H) | 1560 x 1510 x 1770 mm[2] | — |
| Net Weight | 1134 kg[2] | — |
| Force Range | up to 10 kg[3] | — |
| Tool Turret Capacity | up to 8 tools[1] | — |
| Bonding Method | Die Bonder[2] | — |
| Overall Dimensions | 1560 x 1510 x 1770 mm[2] | — |
| Repeatability | 3.5 µm[2] | — |
| Wafer Die attach | Yes[2] | — |
| Model | 3880-II[1] | 10490[4] |
| Equipment type | Die Bonder[1] | — |
| Programming time reduction | up to 95%[1] | — |
| Manufacturer | — | West Bond[4] |
| Description | — | Convertible bonder, wedge to ball[5] |
| Tool type | — | Convertible bonder[6] |
| Bonding modes | — | Wedge bonding and ball bonding[6] |
| Use | — | Wire bonding[6] |
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