Comparison ledger
Laurell 400-series, Laurell H6-8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 400-seriesLaurell | H6-8Laurell |
|---|---|---|
| OEM | Laurell | Laurell |
| Category | Spin coater | Spin coater |
| Wafer size | 150mm | 200mm |
| Process node | — | — |
| Introduced | 1995 | — |
| Production run | 1995– | — |
| Lifecycle | Discontinued | — |
| Lifecycle milestones | 2011 End of life | — |
| Control system | — | — |
| Generation | — | — |
| Family | Laurell 400-series | Laurell H6-8 |
| Cited variants |
|
|
| Specifications | ||
| Process controller | 400-series process controller capable of storing and automatically running process recipes consisting of run time and acceleration rate, with manual operation also supported[1] | — |
| Spin speed | 10,000 RPM (based on a 100 mm SEMI Std. wafer)[3] | — |
| Maximum wafer size | Up to 150 mm wafers[3] | — |
| Substrate size | 4" x 4" (102 mm x 102 mm) substrates[3] | — |
| Standard chuck | 1.75" (45 mm) diameter vacuum chuck[3] | Vacuum chuck[4] |
| Standard adapter coverage | One fragment adapter standard covering 10 mm through 150 mm SEMI wafers[1] | — |
| Housing material | Solid co-polymer blend exclusive to Laurell Technologies[1] | — |
| Power | 95 to 240 VAC, 47/63 Hz, ~300 Watts[1] | 95 to 240VAC, 47/63HZ, ~300 Watts[2] |
| Vacuum suggestion | 25–28 inches Hg vacuum with 4.5 SCFM flow at 0 inches Hg suggested[1] | — |
| Maximum substrate size | Ø150 mm wafers and 4" × 4" (102 mm × 102 mm) substrates[3] | — |
| Maximum speed | 10,000 RPM (based on a Ø100 mm SEMI Std. wafer)[3] | — |
| Vacuum chuck diameter | 1.75" (45 mm) diameter vacuum chuck[1] | — |
| Fragment adapter coverage | 10 mm through 150 mm SEMI wafers[1] | — |
| Power requirement | 95 to 240VAC, 47/63HZ, ~300 Watts[1] | — |
| Maximum rotational speed | — | 12,000 RPM (based on a 100mm silicon wafer)[2] |
| Substrate capacity | — | Up to 7" × 7" (178mm × 178mm) substrates[2] |
| Wafer capacity | — | Up to 200mm wafers[2] |
| Series | — | 650-series HL coater system[2] |
| N2 process/seal purge | — | 60–70 PSIG (4–5 bar) of Nitrogen/ CDA; gas consumption 3 cubic feet per hour (0.085 m3/hour)[2] |
| Vacuum | — | 25–28 inches (~635–711mm) Hg; flow volume 4.5 SCFM (0.127 cubic meters/minute) at 0 inches Hg[2] |
| Typical process use | — | Solvent, Base or Acid-based processing[4] |
| System type | — | Spin coater[4] |
| Standard adapter | — | Fragment adapter[4] |
| Control software | — | Laurell Touch process control software; Spin 3000 PC software[4] |
| Vacuum requirement | — | 25 to 28 inches Hg; 4.5 SCFM at 0 inches Hg[4] |
| Nitrogen/CDA purge pressure | — | 60 to 70 PSIG[4] |
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