Comparison ledger
KLA 0035235-003 MMD Head, KLA 8250 CD-SEM, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 8250 CD-SEMKLA | |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 0035235-003 MMD Head | KLA 8250 CD-SEM |
| Specifications | ||
| Configuration | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Model | 0035235-003[1] | 8250[4] |
| Make | KLA[1] | — |
| Part Description | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Compatible System | KLA AIT-XP[1] | — |
| Feature Size | — | < 30 nm[2] |
| Resolution | — | < 4 nm[2] |
| Electron Source | — | Schottky, Thermal Field Emitter[2] |
| Magnification | — | 2.34 kX – 400 kX[2] |
| Stage Accuracy | — | < 1 µm (laser guided)[2] |
| Accelerating Voltage | — | 0.4 kV – 1.5 kV[2] |
| Throughput | — | up to 55 wafers/hr (8 inch)[3] |
| Wafer Sizes | — | 3 inch, 4 inch, 6 inch, 8 inch[3] |
| Wafer Types | — | Si, SiC, GaN, GaAs, InP, Sapphire, Quartz[3] |
| Wafer Loading Stations | — | 3[3] |
| Operating System | — | Windows NT/XP[3] |
| Power Requirements | — | 120V–220VAC, 1PH, 50/60Hz[2] |
| SMIF Compatibility | — | Yes[3] |
| Type | — | Critical Dimension Scanning Electron Microscope (CD-SEM)[4] |
| Model Year | — | 2005[3] |
| Power | — | 120V-220VAC, 1PH, 50/60HZ[3] |
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