Comparison ledger
Finetech Fineplacer 96, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Fineplacer 96Finetech | 10490West Bond |
|---|---|---|
| OEM | Finetech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Wafer Ring Holder, | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Finetech Fineplacer 96 | West Bond 10490 |
| Specifications | ||
| Configuration | Add On Option:[1] | — |
| Wafer size | Wafer Ring Holder,[2] | — |
| Tool type | Die bonder[2] | Convertible bonder[6] |
| Category | Packaging & Bonding[2] | — |
| Optional modules | Flip Chip Module; Epoxy Dispenser Module; Pick & Place Module; UV Curing System; Heat Plate; Wafer Ring Holder; Accessories; Isolated Table[1] | — |
| Description | Manual FlipChip Bonder[3] | Convertible bonder, wedge to ball[5] |
| Available options | Die Attach; SMD; FLIP CHIP; UV Wafer Ring Release Module[3] | — |
| Bonding accuracy | 0.5 µm[3] | — |
| Max. die/package size | 16 mm (pick-n-place only)[3] | — |
| Min. die/package size | 0.5 mm[3] | — |
| Substrate size | 50 mm × 50 mm (thermal compression); 180 mm × 108 mm (pick-n-place only)[3] | — |
| Bonding environment | Nitrogen / formic acid[3] | — |
| Bonding mechanism | Thermo-compression; reflow; thermo-sonic[3] | — |
| Thermo-compression bonding force | 0.1 ~ 200 N[3] | — |
| Reflow temperature | RT ~ 400 °C[3] | — |
| Reflow heating rate | 20 °C/s[3] | — |
| Manufacturer | — | West Bond[4] |
| Model | — | 10490[4] |
| Bonding modes | — | Wedge bonding and ball bonding[6] |
| Use | — | Wire bonding[6] |
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